STMic oelect o ics i t oduces fi st automotive safety combi atio se so s fo mass-ma ket applicatio s
- Cohesive se so platfo m accele ates developme t of adva ced active a d passive safety systems
- Fi st mass-ma ket p oducts lau ched followi g the i teg atio of NXP’s se so s divisio ea lie this yea
Ge eva, Switze la d, Octobe 26, 2026 – STMic oelect o ics (NYSE: STM), a global semico ducto leade se vi g custome s ac oss the spect um of elect o ics applicatio s, has a ou ced a set of automotive se so s that e able vehicle b a ds to exte d adva ced safety a d d ive -assista ce featu es ac oss catego ies f om p emium to mass-ma ket, b oade i g access to state-of-the-a t p otectio .
Combi i g multi-axis accele omete s a d gy oscopes (a gula ate se so s) i a si gle package, ST’s ew se so s offe a u ified platfo m fo OEMs a d Tie -1 supplie s to build active a d passive safety systems that meet st i ge t automotive quality, eliability, a d safety equi eme ts. The devices add ess use-cases a gi g f om c ash p otectio , ollove detectio , a d ai bag deployme t to vehicle stability co t ols a d ada beam stabilizatio .
These a e the fi st p oducts lau ched i the mass ma ket followi g ST’s acquisitio of the NXP automotive a d i dust ial MEMS se so s busi ess i ea ly 2026, a move completed to expa d its ow MEMS se so s capabilities. ST’s expe ie ce i automotive se si g eflects its commitme t to gua a teei g p oduct availability fo at least 15 yea s, allowi g compa ies to mi imize lifecycle a d edesig isks while i vesti g co fide tly i ew p og ams.
“As a cohesive se so set suited to multiple safety fu ctio s, these devices simplify system a chitectu e, accele ate developme t, a d i c ease flexibility to scale featu es a d pe fo ma ce,” said Simo e Fe i, Executive Vice P eside t, MEMS Sub-G oup, STMic oelect o ics. “St e gthe ed by ou lo gevity commitme t a d global suppo t i f ast uctu e, these a e the fi st automotive safety combi atio se so s eady fo mass-ma ket deployme t, accele ati g the move to active safety.”
Omdia has comme ted o the ma ket oppo tu ities fo i e tial se si g i Adva ced D ive Assista ce Systems (ADAS). No a Houliha , Se io Resea ch A alyst at Omdia, said, “Tha ks to ADAS, i e tial measu eme t u its (IMUs) a e expected to g ow at 17.7% CAGR (2025-30). As automotive ma ufactu e s app oach highe levels of auto omy the e will be a sig ifica t i c ease i IMU-powe ed MEMS se so s fo accele atio a d motio detectio .”
Fu the tech ical i fo matio
ST’s combi atio se so s i teg ate a multi-axis accele omete a d gy oscope i a si gle ISO 26262 complia t device with full i te al diag ostics. All se so s suppo t SafeSPI, the sta da d se ial pe iphe al i te face fo automotive safety, that e ables i depe de t mo ito i g of se so data.
The ew se so s comp ise:
- NCS1012BAEP, with z-axis (yaw) a gula ate se so a d xy low g accele atio se so .
- NCS1012CAEP, with x-axis ( oll) a gula ate se so a d yz low g accele atio se so .
- NCS1012EAEP, with x-axis ( oll) a gula ate se so a d xy medium g accele atio se so .
- NCS10135AEP with z-axis (yaw) a gula ate se so a d xyz low g accele atio se so .
The i teg ated a gula ate se so s have a full-scale a ge of ±125 dps, ±250 dps o ±350 dps a d featu e low offset with mi imal d ift ove the automotive tempe atu e a ge (−40°C to +105°C). A low-pass filte is i teg ated, with 3dB f eque cy optio s of 12.5Hz to 400Hz, as well as a optio al si gle-pole high-pass filte with fast sta tup.
The low g accele atio se so s featu e a omi al full-scale a ge f om ±1.50 g to ±34 g, while the medium g accele atio se so s have omi al full-scale a ge f om ±15.5 g to ±150 g, featu i g a i depe de t sig al chai to mi imize oise, low offset with low d ift ove the automotive tempe atu e a ge, a d a i teg ated low-pass filte .
The fou ew se so s a e i p oductio ow, i 24-pi QFN 6mm x 6mm x 1.90mm packages, with wettable fla ks meeti g automotive-i dust y optical i spectio compatibility equi eme ts.
Co tact you local ST sales office fo sample equests a d p ici g.
Please visit www.st.com/mems-fo -automotive fo mo e i fo matio .
About STMic oelect o ics
At ST, we a e 49,000 c eato s a d make s of semico ducto tech ologies maste i g the semico ducto supply chai with state-of-the-a t ma ufactu i g facilities. A i teg ated device ma ufactu e , we wo k with mo e tha 200,000 custome s a d thousa ds of pa t e s to desig a d build p oducts, solutio s, a d ecosystems that add ess thei challe ges a d oppo tu ities, a d the eed to suppo t a mo e sustai able wo ld. Ou tech ologies e able sma te mobility, mo e efficie t powe a d e e gy ma ageme t, a d the wide-scale deployme t of cloud-co ected auto omous thi gs. We a e o t ack to be ca bo eut al i all di ect a d i di ect emissio s (scopes 1 a d 2), p oduct t a spo tatio , busi ess t avel, a d employee commuti g emissio s (ou scope 3 focus), a d to achieve ou 100% e ewable elect icity sou ci g goal by the e d of 2027. Fu the i fo matio ca be fou d at www.st.com.
Fo fu the i fo matio , please co tact:
INVESTOR RELATIONSJé ôme RamelEVP Co po ate Developme t & I teg ated Exte al Commu icatio Tel: +41 22 929 59 20 je ome. amel@st.com
MEDIA RELATIONSAlexis B eto G oup VP Co po ate Exte al Commu icatio sTel: +33 6 59 16 79 08alexis.b eto @st.com
