Soitec Reports First Quarter Revenue of Fiscal Year 2027

SOITEC REPORTS FIRST QUARTER REVENUE

OF FISCAL YEAR 2027

ACCELERATING PHOTONICS-SOI MOMENTUM

DRIVES STRONG Q1’27 REVENUE, UPGRADED OUTLOOK

AND PUBLICATION AHEAD OF SCHEDULE

• Q1’27 eve ue eached €113m, up 23% yea -o -yea at co sta t cu e cy a d scope, above guida ce of a ou d 15%
• Q1’27 eve ue g owth p ima ily eflects accele atio i Photo ics-SOI, fo high-speed optical t a sceive s i AI Data Ce te s, with sales doubli g yea -o -yea
• 300mm SOI fab i Si gapo e is ow qualified fo high volume ma ufactu i g of Photo ics-SOI with fi st custome s, e abli g the G oup’s ability to captu e accele atio i dema d. Soitec is wo ki g o qualifyi g mo e custome s
• Q2’27 eve ue is expected to g ow mo e tha 30% yea -o -yea , at co sta t cu e cy a d scope, otably sustai ed by a accele atio i Photo ics-SOI dema d
• Soitec’s visibility o Photo ics-SOI e d dema d a d its ability to execute a e imp ovi g. Assumi g o mate ial dis uptio i the AI ma ket, Photo ics-SOI FY27 eve ue is expected to mo e tha double the slightly above $100m ge e ated i FY26
• P ojected FY27 CAPEX cash-out is co fi med a ou d €100m

Be i (G e oble), F a ce, July 22 ^d, 2026

Soitec (Eu o ext Pa is), a wo ld leade i the desig a d ma ufactu i g of i ovative semico ducto mate ials, today a ou ced u audited co solidated eve ue fo the fi st qua te of fiscal yea 2027 (pe iod e ded o Ju e 28^th, 2026).

Si ce the sta t of Q2’27, the G oup has see fu the accele atio i custome dema d fo Photo ics-SOI, as well as the satisfacto y esults of the actio pla i itiated to i c ease its p oductio output. As visibility i the Photo ics-SOI busi ess imp oved mate ially, Soitec published its Q1’27 eve ue ahead of schedule.

Lau e t Rémo t, CEO of Soitec, comme ted: “Q1’27 eve ue came i above ou guida ce, d ive by the st o g accele atio of AI- elated activity, with Photo ics-SOI sales doubli g yea -o -yea .

Visibility o Photo ics-SOI is ow good, as we co ti ue to sig Capacity Rese vatio Ag eeme ts with multiple custome s ove seve al yea s. We have successfully qualified ou Si gapo e 300mm SOI fab with fi st custome s. With highe dema d a d imp oved executio , I am co fide t i the outlook fo the yea , as we adva ce additio al custome qualificatio s.

We a e t acki g to the pla we set out. With the compa y positio ed o a cash ge e atio path, eve ue is ow back to g owth, pavi g the way fo imp oved p ofitability.”

Q1’27 Reve ue

Q1’27 eve ue by e d-ma ket

Mobile Commu icatio s (c. 34% of total Q1’27 eve ue) – POI adoptio suppo ted by key US custome s; RF-SOI impacted by i ve to y co ectio

Mobile Commu icatio s eve ue eached €39 millio i Q1’27, dow 10% yea -o -yea at co sta t cu e cy a d scope. I a co st ai ed sma tpho e ma ket, POI adoptio co ti ues to gai mome tum, while RF-SOI custome s make fu the p og ess i educi g excess i ve to ies. 

RF-SOI sales we e b oadly stable yea -o -yea , as highe 300mm sales offset lowe 200mm RF-SOI sales. 

POI (Piezoelect ic-o -I sulato ) sales we e oughly stable. Highe volumes, eflecti g co ti ued tech ology adoptio , we e offset by lowe p ici g. The ece t lo g-te m ag eeme t with Skywo ks p ovides g eate medium-te m visibility a d ei fo ces POI’s positio as a co e subst ate fo ext-ge e atio filte a chitectu es. 

FD-SOI sales we e lowe yea -o -yea . FD-SOI is the o ly solutio fo fully i teg ated 5G mmWave system-o -chips a d e ables state-of-the-a t RF i teg atio fo Wi-Fi 7 SoCs.

Edge & Cloud AI (c. 57% of total Q1’27 eve ue) – Photo ics-SOI fuels co ti ued g owth

Edge & Cloud AI eve ue eached €65 millio i Q1’27, up 46% yea -o -yea at co sta t cu e cy a d scope.

This st o g pe fo ma ce was p ima ily d ive by Photo ics-SOI, with sales doubli g yea -o -yea , d ive by volumes. Dema d emai s u de pi ed by the g owi g eed fo high-speed, high-ba dwidth optical co ectivity i AI data ce te i f ast uctu e, i cludi g pluggable t a sceive s a d Nea -Package Optics (NPO), as well as the i dust y qualificatio of Co-Packaged Optics (CPO) a chitectu es.

Soitec co ti ues to st e gthe its medium-te m visibility i Photo ics-SOI th ough multi-yea commitme ts f om a g owi g umbe of custome s, a d associated cash deposits. These commitme ts exte d beyo d FY27, while the G oup emai s focused o scali g its Photo ics-SOI p oductio capacity to suppo t accele ati g dema d. I this co text, the qualificatio of its Si gapo e fab fo 300mm Photo ics-SOI p oductio with i itial custome s ma ks a impo ta t milesto e, suppo ti g co fide ce i the amp-up path as the G oup co ti ues to p og ess additio al custome qualificatio s.

FD-SOI sales i Edge & Cloud AI i c eased yea -o -yea , with a slightly positive p ice/mix co t ibutio . FD-SOI tech ology se ves as a p ima y fou datio fo edge computi g a d AI-powe ed applicatio s. By pai i g compute pe fo ma ce with excelle t e e gy efficie cy, FD-SOI e ables co ti uous, always-o AI p ocessi g ac oss co sume , wea ables, healthca e, a d i dust ial IoT ma kets.

Automotive & I dust ial (c. 8% of total Q1’27 eve ue) – Activity emai s subdued; FY27 visibility u de pi ed by custome co t act

Automotive & I dust ial eve ue eached €10 millio i Q1’27, up 108% yea -o -yea at co sta t cu e cy a d scope, albeit f om a low compa iso base, as some custome s co ti ued to wo k th ough excess i ve to ies. The G oup has good visibility fo FY27, suppo ted by a lo g-te m ag eeme t with a key custome .

Powe -SOI sales i c eased yea -o -yea , d ive by highe 200mm volumes. P ima ily used i sma t powe ma ageme t fo elect ic vehicles (EVs), Powe -SOI p ovides the u de lyi g platfo m fo c itical Batte y Ma ageme t Systems (BMS) a d powe co t ol ci cuits ope ati g alo gside adva ced powe semico ducto s. To meet g owi g dema d ac oss vehicle elect ificatio applicatio s, Soitec co ti ues to actively d ive the t a sitio to 300mm wafe s. 

Automotive FD-SOI wafe sales also i c eased yea -o -yea , esse tially suppo ted by la ge volumes. The tech ology is gai i g t actio fo applicatio s such as automotive ada , mic oco t olle s, a d othe a alog/mixed-sig al systems, allowi g ext-ge e atio vehicles to pe ceive a d espo d to thei e vi o me t with supe io powe efficie cy.

Outlook

Soitec expects Q2’27 eve ue to be up mo e tha 30% yea -o -yea , otably sustai ed by a accele atio i Photo ics-SOI.

Looki g ahead, the mome tum behi d Photo ics-SOI keeps buildi g. As AI a chitectu es p og essively adopt optical t a sceive s, SOI delive s highe ba dwidth, lowe late cy a d bette e e gy efficie cy, suppo ti g the accele atio i dema d Soitec has wit essed ove the past seve al mo ths. Beyo d cu e t deployme ts, the i dust y is ow p epa i g the t a sitio to scale-up a chitectu es. This t a sitio is expected to occu th ough successive phases. Photo ics-SOI tech ology has al eady demo st ated its ability to add ess diffe e t scale-up co figu atio s, such as pluggable t a sceive s, Nea -Package Optics (NPO) a d Co-Packaged Optics (CPO).

As the i dust y is e te i g the scale-up e a with mass p oductio of AI I te co ects, Soitec is actively ceme ti g its leade ship i the Photo ics value chai a d wo ki g o captu i g the steep accele atio i custome dema d. I this co text, Soitec’s visibility o Photo ics-SOI e d-dema d a d the G oup’s ability to execute a e imp ovi g. Assumi g o mate ial dis uptio i the AI ma ket, Photo ics-SOI FY27 eve ue is expected to mo e tha double the slightly above $100m ge e ated i FY26. 

This visibility is u de pi ed by accele ati g adoptio ac oss AI data ce te s, expa di g multi-yea custome commitme ts to secu e capacity with cash deposits, a st o g sig al of e gageme t to secu i g lo g-te m supply with Soitec. Fu the volumes a e u de active discussio .

Fo FY27, we expect co t asti g dy amics ac oss ou e d ma kets. I Mobile Commu icatio s, p og ess i POI should be offset by the o goi g custome i ve to y co ectio i RF-SOI, i a challe gi g sma tpho e ma ket. I Automotive, the good visibility stemmi g f om a custome lo g-te m ag eeme t mea s that a y ea ly sig s of e d-ma ket ecove y would ot be expected to be efit the G oup this yea . By co t ast, Edge & Cloud AI mome tum co ti ues to imp ove, d ive by accele ati g dema d fo Photo ics-SOI.

P ojected FY27 CAPEX cash-out is co fi med a ou d €100m.

Key eve ts of Q1’27

Soitec qualifies its Si gapo e 300mm SOI fab fo high volume ma ufactu i g of Photo ics-SOI subst ates

Soitec qualified its 300mm SOI fab icatio facility i Si gapo e with its fi st custome s fo high-volume Photo ics-SOI ma ufactu i g. This milesto e e ha ces the G oup’s capacity to meet su gi g dema d fo Photo ics-SOI d ive by AI data ce te a chitectu es. Suppo ted by g owi g visibility o dema d, secu ed by custome dow payme ts, Soitec is scali g its i dust ial footp i t th ough a discipli ed, co t olled i vestme t st ategy. The Si gapo e site is ce t al to this effo t; its st ategic locatio a d established 300mm ma ufactu i g capabilities allow Soitec to se ve the Photo ics-SOI ma ket with i c eased agility a d scale. Combi ed with the G oup’s facilities i Be i , this dual-site ma ufactu i g footp i t p ovides obust supply chai esilie ce, fu the solidifyi g Soitec’s positio as a pa t e of choice fo the apidly evolvi g photo ics ecosystem.

Soitec a d Ze Semi a ou ce st ategic collabo atio to scale 300mm BCD-o -SOI p oductio fo ext-ge e atio powe elect o ics

O Ju e 29^th, 2026, Soitec a d Ze Semi a ou ced a st ategic collabo atio to e able high-volume p oductio of 300mm BCD-o -SOI tech ologies fo ext-ge e atio powe elect o ics. U de the pa t e ship, Soitec will supply Ze Semi with its adva ced 300mm Powe -SOI subst ates to suppo t the developme t a d capacity amp-up of a ew BCD-o -SOI p ocess. By combi i g Soitec’s e gi ee ed subst ate expe tise with Ze Semi’s specialty fou d y capabilities, the collabo atio aims to p ovide fabless compa ies a d i teg ated device ma ufactu e s with a high-pe fo ma ce ma ufactu i g platfo m fo applicatio s i cludi g AI datace te s, elect ic vehicles, huma oid obots a d i dust ial systems. The pa t e ship also suppo ts the b oade t a sitio towa d mo e eliable, powe -de se chip a chitectu es, with BCD-o -SOI e abli g adva ced i teg atio fo high-efficie cy powe dist ibutio , batte y ma ageme t systems a d othe ext-ge e atio applicatio s.

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Q1’27 Reve ue will be p ese ted du i g a a alyst a d i vesto meeti g o July 23 ^d, 2026, at 8:00am CET. The meeti g will be held i E glish.

The live webcast will be available o :https://soitec.e gagest eam.eu o ext.com/2027-fi st-qua te – eve ue

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2026 A ual Ge e al Meeti gSoitec’s A ual Ge e al Meeti g of sha eholde s will be held o July 29^th, 2026.

H1’27 ResultsH1’27 Results a e due to be published o Novembe 18^th, 2026, afte ma ket close.

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Disclaime

This docume t is p ovided by Soitec (the “Compa y”) fo i fo matio pu poses o ly.

The Compa y’s busi ess ope atio s a d fi a cial positio a e desc ibed i the Compa y’s U ive sal Regist atio Docume t (which otably i cludes the A ual Fi a cial Repo t). The 2025-2026 U ive sal Regist atio Docume t was filed o Ju e 10^th, 2026, with the F e ch stock ma ket autho ity (Auto ité des Ma chés Fi a cie s, o AMF) u de umbe D.26-0417. The F e ch ve sio s of the 2025-2026 U ive sal Regist atio Docume t, togethe with E glish cou tesy t a slatio fo i fo matio pu poses, a e available fo co sultatio si ce Ju e 10^th, 2026, o the Compa y’s website (www.soitec.com), i the sectio I vesto s – Regulated i fo matio – Fi a cial Repo ts.

You atte tio is d aw to the isk facto s desc ibed i Chapte 2.1 (Risk facto s a d co t ols mecha ism) of the Compa y’s U ive sal Regist atio Docume t.

This docume t co tai s summa y i fo matio a d should be ead i co ju ctio with the U ive sal Regist atio Docume t.

This docume t co tai s ce tai fo wa d-looki g stateme ts. These fo wa d-looki g stateme ts elate to the Compa y’s futu e p ospects, developme ts a d st ategy a d a e based o a alyses of ea i gs fo ecasts a d estimates of amou ts ot yet dete mi able. By thei atu e, fo wa d-looki g stateme ts a e subject to a va iety of isks a d u ce tai ties as they elate to futu e eve ts a d a e depe de t o ci cumsta ces that may o may ot mate ialize i the futu e. Fo wa d-looki g stateme ts a e ot a gua a tee of the Compa y’s futu e pe fo ma ce. The occu e ce of a y of the isks desc ibed i Chapte 2.1 (Risk facto s a d co t ols mecha ism) of the U ive sal Regist atio Docume t may have a impact o these fo wa d-looki g stateme ts.

The Compa y’s actual fi a cial positio , esults a d cash flows, as well as the t e ds i the secto i which the Compa y ope ates may diffe mate ially f om those co tai ed i this docume t. Fu the mo e, eve if the Compa y’s fi a cial positio , esults, cash-flows a d the developme ts i the secto i which the Compa y ope ates we e to co fo m to the fo wa d-looki g stateme ts co tai ed i this docume t, such eleme ts ca ot be co st ued as a eliable i dicatio of the Compa y’s futu e esults o developme ts.

The Compa y does ot u de take a y obligatio to update o make a y co ectio to a y fo wa d-looki g stateme t i o de to eflect a eve t o ci cumsta ce that may occu afte the date of this docume t.

This docume t does ot co stitute o fo m pa t of a offe o a solicitatio to pu chase, subsc ibe fo , o sell the Compa y’s secu ities i a y cou t y whatsoeve . This docume t, o a y pa t the eof, shall ot fo m the basis of, o be elied upo i co ectio with, a y co t act, commitme t o i vestme t decisio .

Notably, this docume t does ot co stitute a offe o solicitatio to pu chase, subsc ibe fo o to sell secu ities i the U ited States. Secu ities may ot be offe ed o sold i the U ited States abse t egist atio o a exemptio f om the egist atio u de the U.S. Secu ities Act of 1933, as ame ded (the “Secu ities Act”). The Compa y’s sha es have ot bee a d will ot be egiste ed u de the Secu ities Act. Neithe the Compa y o a y othe pe so i te ds to co duct a public offe i g of the Compa y’s secu ities i the U ited States.

About Soitec

Soitec (Eu o ext – Tech Leade s – SBF 120), a wo ld leade i i ovative semico ducto mate ials, has bee developi g cutti g-edge p oducts delive i g both tech ological pe fo ma ce a d e e gy efficie cy fo ove 30 yea s. F om its global headqua te s i F a ce, Soitec is expa di g i te atio ally with its u ique solutio s, a d ge e ated sales of a ou d 600 millio eu os i fiscal yea 2025-2026. Soitec occupies a key positio i the semico ducto value chai , se vi g th ee mai st ategic ma kets: Mobile Commu icatio s, Automotive a d I dust ial, a d Edge a d Cloud AI. The compa y elies o the tale t a d dive sity of ea ly 2,000 employees, ep ese ti g 50 diffe e t atio alities, wo ki g at its sites i Eu ope, the U ited States a d Asia. Nea ly  4,800 pate ts have bee egiste ed by Soitec.

Soitec, Sma tSiC™ a d Sma t Cut™ a e egiste ed t adema ks of Soitec.

Fo mo e i fo matio soitec.com a d follow us o Li kedI a d X: @Soitec_Official

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I vesto Relatio s: i vesto s@soitec.comMedia Relatio s: media@soitec.com

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Co solidated eve ue pe qua te

Attachme t

• ENGLISH – Soitec Q1’27 Results – P ess elease EN