CHANDLER, A iz., July 15, 2026 (GLOBE NEWSWIRE) — Sa as Mic o Devices, a eme gi g leade i cutti g-edge powe pe fo ma ce solutio s leve agi g i teg ated packagi g desig , today a ou ced the expa sio of its se io leade ship team with the appoi tme t of Shau Bowe s as se io vice p eside t of p oduct ma ageme t a d Geo gette Woodya d as se io vice p eside t of sales a d busi ess developme t.
The appoi tme ts come as Sa as adva ces f om tech ology developme t towa d p oduct scali g, custome validatio a d b oade comme cial e gageme t. The compa y co ti ues to see g owi g i te est f om majo global custome s, pa ticula ly i AI i f ast uctu e, as powe delive y becomes a c itical co st ai t fo ext-ge e atio p ocesso s, accele ato s a d adva ced packages.
The leade ship additio s also eflect Sa as’ ability to att act se io semico ducto tale t as it co ti ues to build its team ac oss its Cha dle , A izo a a d Atla ta facilities, suppo ted by ece t 3D I Cites Best Place to Wo k ecog itio .
“We a e att acti g leade s who have built semico ducto p oducts, wo ked closely with global custome s a d u de sta d what it takes to move adva ced packagi g tech ologies i to comme cial ma kets,” said Ro Huemoelle , CEO of Sa as Mic o Devices. “Sa as is at the poi t whe e p oduct st ategy, custome e gageme t a d executio must move i lockstep. Shau a d Geo gette b i g that expe ie ce a d a e st e gthe i g a team that has built eal mome tum. This additio is st ategically impo ta t as we t a sitio f om p ovi g the tech ology to scali g the busi ess.”
Bowe s b i gs mo e tha 25 yea s of semico ducto i dust y expe ie ce ac oss adva ced packagi g, ma ufactu i g, p oduct developme t a d busi ess st ategy. He joi s Sa as afte se vi g as p i cipal co sulta t of his ow fi m, whe e he advised compa ies o tech ical ma ket a alysis, busi ess developme t st ategy a d mo etizi g i ovatio . He p eviously spe t 23 yea s at Amko Tech ology, whe e he held se io leade ship oles i cludi g vice p eside t of busi ess a alytics a d st ategic e gageme t, vice p eside t of powe p oducts a d vice p eside t of package developme t a d tech ology i teg atio .
As se io vice p eside t of p oduct ma ageme t at Sa as Mic o Devices, Bowe s will focus o alig i g Sa as’ tech ology oadmap with custome equi eme ts, ma ufactu i g co side atio s a d busi ess p io ities.
“The challe ge ow is ot simply p ovi g that the tech ology wo ks. It is maki g su e the p oduct oadmap, custome equi eme ts a d ma ufactu i g path a e alig ed ea ly,” said Bowe s. “Powe delive y is becomi g a package-level co st ai t, a d custome s eed solutio s that ca meet thei elect ical ta gets while fitti g i to eal qualificatio , eliability a d p oductio equi eme ts. That is whe e discipli ed p oduct ma ageme t ca make a measu able diffe e ce.”
Woodya d b i gs mo e tha 35 yea s of semico ducto packagi g expe ie ce, with a focus o global sales, custome e gageme t, busi ess developme t a d eve ue g owth. She b i gs deep OSAT a d adva ced packagi g expe ie ce f om se io oles at Amko Tech ology a d STATS ChipPAC, whe e she led the compa y’s la gest sales egio , d ove ma ket sha e expa sio , deepe ed custome e gageme t a d suppo ted c oss-fu ctio al alig me t to imp ove the custome expe ie ce.
As se io vice p eside t of sales a d busi ess developme t, Woodya d will lead Sa as’ sales st ategy, custome e gageme t, ma ket expa sio a d st ategic pa t e ships. He ole will focus o co ve ti g ea ly custome i te est i to du able comme cial elatio ships as Sa as moves towa d b oade ma ket adoptio .
“Custome s ecog ize the powe delive y p oblem is o lo ge theo etical, but adoptio of eme gi g solutio s still depe ds o t ust, timi g a d clea executio ,” said Woodya d. “My focus is to make su e we a e close to the ight custome s a d pa t e s, u de sta d what they eed to move f om evaluatio to adoptio a d build the comme cial path that suppo ts Sa as’ lo g-te m g owth.”
A photo accompa yi g this a ou ceme t is available at https://www.globe ewswi e.com/NewsRoom/Attachme tNg/99502a70-b175-4e8b-a9ac-1f07749cb8c8
