A lo g-sta di g RIBER custome fo mo e tha twe ty yea s, 3SP Tech ologies has o ce agai eaffi med its co fide ce i the Compa y’s tech ologies th ough this ew o de , fu the st e gthe i g a lo g-te m i dust ial pa t e ship.
A subsidia y of the O-Net Commu icatio s G oup, 3SP Tech ologies is a ecog ized desig e a d ma ufactu e of high-pe fo ma ce lase chips a d modules fo optical telecommu icatio s etwo ks a d ext-ge e atio Datacom i f ast uctu es. Its p oducts suppo t the co ti uous g owth of global data t affic a d the apid expa sio of AI-d ive digital a chitectu es.
The ew system will e able 3SP Tech ologies to expa d its i dust ial p oductio capacity i o de to meet g owi g dema d fo high-pe fo ma ce photo ic compo e ts used i ext-ge e atio optical etwo ki g applicatio s.
Epitaxy is a c itical step i the ma ufactu i g of adva ced semico ducto devices, di ectly dete mi i g compo e t pe fo ma ce, eliability a d ep oducibility. RIBER’s i dust ial MBE platfo ms a e desig ed to meet the highest sta da ds of p ocess stability, depositio u ifo mity a d ma ufactu i g p oductivity, e abli g custome s to efficie tly scale thei i dust ial p oductio .
The co ti ued loyalty of custome s such as 3SP Tech ologies eflects both the quality of RIBER’s tech ological solutio s a d the value of the lo g-te m i dust ial pa t e ships the Compa y has built ove the yea s. With its MBE p oductio platfo ms dedicated to lase a d photodetecto ma ufactu i g, compleme ted by the ROSIE platfo m fo ult a-fast, low-loss elect o-optic modulatio applicatio s, RIBER ow p ovides a comp ehe sive tech ology po tfolio add essi g the i dust ial equi eme ts of the ext ge e atio of photo ic chips fo a tificial i tellige ce a d Datacom i f ast uctu es.
“This ew o de eflects the lasti g co fide ce of o e of ou lo g-sta di g custome s, with whom we have pa t e ed fo mo e tha two decades. It co fi ms ou platfo ms’ ability to meet the most dema di g i dust ial equi eme ts fo the p oductio of high-pe fo ma ce photo ic compo e ts. The fact that seve al of ou custome s ope ate sig ifica t i stalled bases of RIBER systems is a st o g e do seme t of the eliability of ou tech ologies, ou expe tise a d the commitme t of ou teams,” said A ie Geoff oy, Chai woma a d Chief Executive Office of RIBER.
“This ew o de will sig ifica tly i c ease the p oductio capacity of 3SP Tech ologies’ 980 m high-powe lase diodes. This will e able 3SP Tech ologies to e ha ce its custome s’ suppo t to bette satisfy the boomi g dema d fo these p oducts i data ce te i te co ects, Hype – ails system a d othe i dust ial applicatio s, a d ei fo ce 3SP Tech ologies’ leadi g positio i this g owi g ma ket. It also eflects 3SP’s lasti g co fide ce i RIBER, built o mo e tha two decades of pa t e ship,” said Austi Na, Chai ma of 3SP Tech ologies, a d Chai ma a d Chief Executive Office of O-Net Commu icatio s G oup.
Fou ded i 1994, 3SP Tech ologies develops, ma ufactu es, a d ma kets optoelect o ic compo e ts, i cludi g III-V semico ducto lase chips, photo ic i teg ated ci cuits a d modules fo data ce te a d telecommu icatio applicatio s. Si ce 2014, it has bee the subsidia y of O-Net Commu icatio s G oup i F a ce a d the u ique R&D a d p oductio site o III-V semico ducto chips of O-Net G oup. 3SP Tech ologies is o e of the wo ld-wide leade s o 980 m high powe lase diodes a d o high powe 14XX/15XX m Rama pumps, which a e key devices i AI-d ive data-ce te i te co ects.
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Fou ded i 1964, RIBER is the global leade fo molecula beam epitaxy (MBE) equipme t. The Compa y desig s a d ma ufactu es solutio s fo the semico ducto i dust y a d suppo ts its custome s – i dust ial playe s a d esea ch labo ato ies – with a comp ehe sive a ge of se vices a d scie tific a d tech ical suppo t (ha dwa e a d softwa e), aimed at optimizi g equipme t pe fo ma ce a d yield.
RIBER’s tech ologies a e at the co e of the developme t of adva ced semico ducto devices, pa ticula ly fo applicatio s elated to a tificial i tellige ce, data i f ast uctu e, telecommu icatio s a d photo ics. With the lau ch of ROSIE (RIBER Oxide o Silico Epitaxy), a platfo m dedicated to silico -based i teg ated photo ics compatible with 300 mm p oductio li es, RIBER is ope i g up ew oppo tu ities i high-g owth ma kets.
Positio ed i st ategic tech ology segme ts, RIBER also co t ibutes to adva ces i esea ch a d qua tum tech ologies.
RIBER is ecog ized as a ‘I ovative Compa y’ by Bpif a ce” a d is listed o the Eu o ext G owth Pa is ma ket (ISIN: FR0000075954).
