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Home Artificial Intelligence

International Workshop & Competition at AI Top Conference ECCV 2026 sponsored by Tec-Do and MiniMax

July 4, 2026
in Artificial Intelligence, GlobeNewswire, Web3
Reading Time: 7 mins read
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Tec-Do Tech ology

GUANGZHOU, Chi a, July 04, 2026 (GLOBE NEWSWIRE) — The o ga izi g committee ece tly a ou ced the official lau ch of the MARS2 Multimodal Reaso i g Competitio . Spo so ed by Tec-Do a d Mi iMax, a flagship eve t held alo gside the MARS2 Wo kshop at the upcomi g Eu opea Co fe e ce o Compute Visio (ECCV 2026). Backed by a total p ize pool of $100,000 USD, the challe ge aims to b idge va gua d academic esea ch with high-impact, eal-wo ld i dust y applicatio s.

U like t aditio al AI be chma ks co fi ed to closed tasks, the MARS2 competitio shifts the pa adigm towa d complex, ope -wo ld easo i g, deep “slow-thi ki g” capabilities, a d lo g-chai multi-step i fe e ces. The co test ce te s o th ee disti ct t acks desig ed to tho oughly test multimodal models i complex, e te p ise-level e vi o me ts:

  1. MAC (Multimodal Adve tiseme t Comp ehe sio ): Evaluates a model’s holistic g asp of video a atives, c oss-modal i teg atio , a d its capacity fo lo g-co text sema tic summa izatio .
  2. VTG (Video Tempo al G ou di g): Measu es fi e-g ai ed tempo al alig me t a d sema tic localizatio withi dy amic video st eams.
  3. MDC (Ma keti g St ategy Decodi g a d Co ve sio A alysis): Challe ges models to decode psychological t igge s, b a d placeme ts, a d use ete tio mecha isms withi comme cial co texts.

B idgi g Va gua d Resea ch with Real-Wo ld I dust y Value

Fo academic esea che s, MARS2 offe s a obust, challe gi g be chma k to pio ee ope -wo ld ge e alizatio a d testi g-time easo i g. Fo i dust y p actitio e s, it se ves as a c itical sa dbox to t a sitio aw computi g powe i to p oductive comme cial esults—specifically withi digital ma keti g, i tellige t decisio -maki g, a d st uctu al cost-optimizatio .

The wo kshop featu es a elite li eup of i vited key ote speake s, i cludi g:

Paul Lia g (Massachusetts I stitute of Tech ology)

Mihaela va de Schaa  (U ive sity of Camb idge)

Louis-Philippe Mo e cy (Ca egie Mello U ive sity)

Call fo Pape s (CFP)

The MARS2 Wo kshop at ECCV 2026 wa mly i vites ovel submissio s spa i g academia a d i dust y. Topics of i te est i clude, but a e ot limited to: Multimodal Reaso i g, Lo g-Chai I fe e ce, Ze o-Shot Ge e alizatio , Age tic Systems, Neu al-Symbolic Models, a d Robust ess Be chma ki g.

Key Deadli es & Timeli e:

Submissio Deadli e: August 1, 2026

Accepta ce Notificatio : August 8, 2026

Came a-Ready Deadli e: August 12, 2026

Submissio Po tal: Ope Review Po tal

Disti guished O ga izi g Committee

The eve t is joi tly stewa ded by leadi g mi ds ac oss global esea ch hubs a d tech secto s:

Depi Che  (Tec-Do Tech ology)

Kyou g Mu Lee (Seoul Natio al U ive sity)

Che Cha ge Loy (Na ya g Tech ological U ive sity)

David Clifto  (U ive sity of Oxfo d)

Xi wei Lo g (Tsi ghua U ive sity)

Luc Va Gool (INSAIT Sofia U ive sity)

Eve t Logistics & How to Joi

Eve t Date: Septembe 8–9, 2026

Locatio : Malmö, Swede

Challe ge Platfo m: Regist atio , submissio s, a d live leade boa ds will be hosted o the EvalAI Challe ge Page.

To explo e the f o tie s of multimodal i tellige ce alo gside global pee s at ECCV 2026, visit the official cha els below to egiste o submit you wo k.

Official Website: https://ma s2wo kshop.github.io/eccv2026/

I qui ies & Co tact: ma s2wo kshop2026@gmail.com

Compa y: Tec-Do Tech ology Co., Limited

Co tact Pe so : Mo ica Gua

Email: b a d@tec-do.com

Website: https://www.tec-do.com/

Telepho e: +8613924135206

City: Gua gzhou, Chi a

A photo accompa yi g this a ou ceme t is available at https://www.globe ewswi e.com/NewsRoom/Attachme tNg/6dd239ca-745a-4a5c-a985-99b3a4e2f109

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