TAINAN, Taiwa , Ju e 30, 2026 (GLOBE NEWSWIRE) — Himax Tech ologies, I c. (Nasdaq: HIMX) (“Himax” o “Compa y”), a leadi g supplie a d fabless ma ufactu e of display d ive s a d othe semico ducto p oducts, today a ou ced the lau ch of its ew HE Se ies i di ect Time-of-Flight (iToF) Depth Decode ICs, fu the expa di g Himax’s po tfolio i 3D se si g a d machi e visio applicatio s. Leve agi g a high-pe fo ma ce ha dwa e-based depth p ocessi g a chitectu e, adva ced image e ha ceme t tech ologies, a d a comp ehe sive ha dwa e a d softwa e developme t platfo m, the ew iToF decode IC delive s high-f ame- ate a d high-p ecisio 3D se si g capabilities, p ovidi g a complete, easy-to-i teg ate 3D se si g solutio fo obotics, i dust ial automatio , a d a b oad a ge of AI visio applicatio s.
The HE Se ies iToF depth decode IC’s ha dwa e-based a chitectu e sig ifica tly imp oves p ocessi g efficie cy a d educes system late cy compa ed with co ve tio al softwa e-based depth p ocessi g solutio s, e abli g faste a d mo e espo sive depth se si g pe fo ma ce. It also suppo ts up to 640 × 480 RAW data i put at 240 fps i both si gle-f eque cy a d dual-f eque cy modes. Followi g high-speed depth decodi g, the IC ca simulta eously output 2D g ayscale images a d 3D depth i fo matio th ough MIPI a d USB i te faces at f ame ates of up to 120 fps.
I additio , the iToF depth decode IC has bee validated fo compatibility with leadi g i dust y-sta da d VGA- esolutio iToF se so s, helpi g custome s accele ate developme t a d sho te time-to-ma ket. The solutio has al eady bee adopted by multiple i dust y pa t e s fo machi e visio applicatio s. Amo g them, leadi g optical module ma ufactu e OFILM has i co po ated Himax’s iToF depth decode IC i to its ew RoboVisio solutio , delive i g high-p ecisio 3D se si g capabilities that suppo t a wide a ge of obotic applicatio s, i cludi g object picki g, obstacle avoida ce, e vi o me t mappi g, a d auto omous avigatio .
To meet g owi g dema d fo high-p ecisio depth se si g i obotics a d i tellige t visio applicatio s, the ew iToF decode IC i co po ates a suite of adva ced depth image e ha ceme t tech ologies, i cludi g depth oise eductio , flyi g pixel emoval, a d tempo al filte i g. These featu es imp ove the accu acy, stability, a d eliability of depth data, pa ticula ly i high-speed motio sce a ios a d complex ope ati g e vi o me ts.
Himax also p ovides a comp ehe sive Softwa e Developme t Kit (SDK) a d a p ofessio al iToF Calib atio Lib a y to suppo t a wide a ge of depth calib atio algo ithms, i cludi g Fixed Pixel Phase Noise (FPPN) co ectio , Wiggli g Compe satio , a d The mal Compe satio , as well as came a i t i sic calib atio a d le s disto tio co ectio . These capabilities help imp ove depth measu eme t accu acy, system stability, a d e vi o me tal obust ess, while simplifyi g system developme t a d i teg atio , ultimately educi g developme t effo t a d accele ati g time-to-ma ket.
The HE Se ies iToF decode IC co sists of the sta da d HE-1 a d the adva ced HE-2. The HE-2 suppo ts RGB came a i teg atio a d i co po ates a built-i RGB ISP, MJPEG e code , a d RGB-D alig me t e gi e fo p ecise fusio of RGB images a d depth i fo matio . This allows host systems to di ectly access sy ch o ized depth data, educi g additio al p ocessi g equi eme ts a d simplifyi g ove all system a chitectu e. Fu the , the HE-2 i co po ates a edge AI Neu al P ocessi g U it (NPU) capable of suppo ti g eye t acki g, gestu e ecog itio , a d a wide a ge of AI visio algo ithms. By combi i g pe ceptio , i tellige ce, a d i te actio capabilities withi a si gle platfo m, the HE-2 e ables develope s to build adva ced i tellige t visio systems fo obotics, huma -machi e i te actio , a d dive se AIoT applicatio s.
“As obotics, sma t ma ufactu i g, a d othe i tellige t visio applicatio s co ti ue to adva ce, dema d fo eal-time, high-p ecisio 3D se si g is g owi g apidly,” said Pe -Hsi Che , Vice P eside t of the Image P ocessi g SoC Busi ess U it at Himax. “Leve agi g Himax’s exte sive expe tise i 3D se si g a d image p ocessi g tech ologies, the HE se ies iToF decode IC combi es a high-speed depth p ocessi g a chitectu e with adva ced image e ha ceme t capabilities to delive a highly accu ate, low-late cy, a d easy-to-i teg ate 3D se si g solutio , helpi g custome s sho te developme t cycles a d accele ate time-to-ma ket.”
Himax Tech ologies, I c. (NASDAQ: HIMX) is a leadi g global fabless semico ducto solutio p ovide dedicated to display imagi g p ocessi g tech ologies. The Compa y’s display d ive ICs a d timi g co t olle s have bee adopted at scale ac oss multiple i dust ies wo ldwide i cludi g TVs, PC mo ito s, laptops, mobile pho es, tablets, automotive, ePape devices, i dust ial displays, amo g othe s. As the global ma ket sha e leade i automotive display tech ology, the Compa y offe s i ovative a d comp ehe sive automotive IC solutio s, i cludi g t aditio al d ive ICs, adva ced i -cell Touch a d Display D ive I teg atio (TDDI), local dimmi g timi g co t olle s (Local Dimmi g Tco ), La ge Touch a d Display D ive I teg atio (LTDI) a d OLED display tech ologies. Himax is also a pio ee i ti yML visual-AI a d optical tech ology elated fields. The Compa y’s i dust y-leadi g WiseEyeTM Ult alow Powe AI Se si g tech ology which i co po ates Himax p op ieta y ult alow powe AI p ocesso , always-o CMOS image se so , a d CNN-based AI algo ithm has bee widely deployed i co sume elect o ics a d AIoT elated applicatio s. Himax optics tech ologies, such as diff active wafe level optics, LCoS mic odisplays a d 3D se si g solutio s, a e c itical fo facilitati g eme gi g AR/VR/metave se tech ologies. Additio ally, Himax desig s a d p ovides touch co t olle s, OLED ICs, LED ICs, EPD ICs, powe ma ageme t ICs, a d CMOS image se so s fo dive se display applicatio cove age. Fou ded i 2001 a d headqua te ed i Tai a , Taiwa , Himax cu e tly employs a ou d 2,200 people f om th ee Taiwa -based offices i Tai a , Hsi chu a d Taipei a d cou t y offices i Chi a, Ko ea, a d the US. Himax has 2,564 pate ts g a ted a d 331 pate ts pe di g app oval wo ldwide as of Ma ch 31, 2026.
Facto s that could cause actual eve ts o esults to diffe mate ially f om those desc ibed i clude, but a e ot limited to, the effect of the Covid-19 pa demic o the Compa y’s busi ess; ge e al busi ess a d eco omic co ditio s a d the state of the semico ducto i dust y; ma ket accepta ce a d competitive ess of the d ive a d o -d ive p oducts developed by the Compa y; dema d fo e d-use applicatio s p oducts; elia ce o a small g oup of p i cipal custome s; the u ce tai ty of co ti ued success i tech ological i ovatio s; ou ability to develop a d p otect ou i tellectual p ope ty; p ici g p essu es i cludi g decli es i ave age selli g p ices; cha ges i custome o de patte s; cha ges i estimated full-yea effective tax ate; sho tage i supply of key compo e ts; cha ges i e vi o me tal laws a d egulatio s; cha ges i expo t lice se egulated by Expo t Admi ist atio Regulatio s (EAR); excha ge ate fluctuatio s; egulato y app ovals fo fu the i vestme ts i ou subsidia ies; ou ability to collect accou ts eceivable a d ma age i ve to y a d othe isks desc ibed f om time to time i the Compa y’s SEC fili gs, i cludi g those isks ide tified i the sectio e titled “Risk Facto s” i its Fo m 20-F fo the yea e ded Decembe 31, 2025 filed with the SEC, as may be ame ded.
