High NA EUV reaches new readiness milestone with first high-volume Logic product

High NA EUV eaches ew eadi ess milesto e with fi st high-volume Logic p oduct

• I tel Fou d y has e te ed high-volume ma ufactu i g fo a subset of I tel® Co e™ Ult a Se ies 3 p ocesso s, code- amed Pa the Lake, usi g ASML’s EXE High NA EUV tech ology
• Specific I tel 18A laye s a e ow dual-qualified o High NA EUV i O ego , with p oduct shippi g to custome s at yields matched to the NXE platfo m
• I tel a d ASML co ti ue to closely collabo ate o High NA EUV eadi ess with flexibility to i co po ate i to futu e odes based o custome eeds

VELDHOVEN, the Nethe la ds, July 15, 2026 – ASML Holdi g N.V. (ASML) today epo ted that I tel Fou d y is usi g ASML’s High NA EUV tech ology o the I tel 18A p ocess ode to p oduce a subset of its I tel® Co e™ Ult a Se ies 3 p ocesso s. This milesto e ma ks a impo ta t step i demo st ati g High NA EUV eadi ess i a p oductio e vi o me t.

ASML a d I tel have wo ked closely fo decades to adva ce lithog aphy tech ology a d suppo t the co ti ued scali g of semico ducto s. The high ume ical ape tu e ext eme ult aviolet (High NA EUV) lithog aphy p ocess is a impo ta t ext step i EUV lithog aphy, developed by ASML to e able mo e p ecise patte i g fo adva ced chip ma ufactu i g.

The I tel® Co e™ Ult a Se ies 3 p ocesso s, code- amed Pa the Lake, a e built o I tel 18A. The use of High NA EUV to patte specific laye s of these p oducts p ovides ASML a d I tel Fou d y with helpful data to fu the efi e system setup, up time a d ma ufactu i g impleme tatio . This paves the way towa ds b oade adoptio , utilizi g the full capabilities of the tech ology.

“With i c eased esolutio a d bette p ocess co t ol, the i t oductio of High NA EUV ma ks a substa tial developme t i semico ducto lithog aphy,” said Ch istophe Fouquet, ASML P eside t a d CEO. “We a e p oud to play a ole i e abli g the smalle , de se patte i g that will accele ate adva ceme ts i AI a d othe eme gi g tech ologies.”

“This milesto e eflects the close tech ical collabo atio betwee I tel a d ASML a d shows how High NA EUV ca be i teg ated i to adva ced semico ducto ma ufactu i g at scale,” said Naga Cha d aseka a , Executive Vice P eside t a d Ge e al Ma age of I tel Fou d y. “By qualifyi g the High NA EUV p ocess optio o select I tel 18A p oduct laye s, ou existi g fleet of tools a e p ovidi g custome s with i c eased output, while we develop futu e optio s to achieve leadi g-edge pe fo ma ce, de sity a d ma ufactu i g flexibility o upcomi g odes.”

I 2024, I tel a d ASML completed i teg atio of the i dust y’s fi st comme cial High NA EUV lithog aphy system at the compa y’s Hillsbo o, O ego , R&D site. I tel Fou d y was also the fi st compa y to i stall a d pass accepta ce testi g of the seco d ge e atio , TWINSCAN EXE:5200B, which builds o the TWINSCAN EXE:5000 a d i c eases output a d ove lay accu acy, alo g with a imp oved light sou ce. With this a ou ceme t, I tel Fou d y is fi st i the i dust y to ship high-volume logic p oduct usi g High NA EUV.

About ASMLASML is a leadi g supplie to the semico ducto i dust y. The compa y p ovides chipmake s with ha dwa e, softwa e a d se vices to mass p oduce the patte s of i teg ated ci cuits (mic ochips). Togethe with its pa t e s, ASML d ives the adva ceme t of mo e affo dable, mo e powe ful, mo e e e gy-efficie t mic ochips. ASML e ables g ou db eaki g tech ology to solve some of huma ity’s toughest challe ges, such as i healthca e, e e gy use a d co se vatio , mobility a d ag icultu e. ASML is a multi atio al compa y headqua te ed i Veldhove , the Nethe la ds, with offices ac oss EMEA, the US a d Asia. Eve y day, ASML’s mo e tha 44,500 employees (FTE) challe ge the status quo a d push tech ology to ew limits. ASML is t aded o Eu o ext Amste dam a d NASDAQ u de the symbol ASML. Discove ASML – ou p oducts, tech ology a d ca ee oppo tu ities – at www.asml.com.

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