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Home Artificial Intelligence

FormFactor and Teradyne Announce Strategic Collaboration to Accelerate Next-Generation Semiconductor Testing

October 13, 2026
in Artificial Intelligence, GlobeNewswire, Web3
Reading Time: 7 mins read
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Compa ies to combi e leade ship i p obe, i te face, a d test tech ologies to accele ate AI a d high-pe fo ma ce compute deployme ts

LIVERMORE, Calif., Oct. 12, 2026 (GLOBE NEWSWIRE) — Fo mFacto , I c. (Nasdaq: FORM), a leadi g p ovide of semico ducto test a d measu eme t tech ologies, a d Te ady e, I c. (Nasdaq: TER), a leadi g p ovide of automated test equipme t a d adva ced obotics, today a ou ced the two compa ies have e te ed i to a b oad tech ology collabo atio aimed at accele ati g the developme t, validatio , a d high-volume p oductio deployme t of ext-ge e atio semico ducto devices. I additio , Te ady e has ag eed to pu chase sha es of Fo mFacto commo stock.

The collabo atio b i gs togethe Fo mFacto ’s i dust y-leadi g expe tise i p obe tech ologies, i te face solutio s, test e gi ee i g, a d device cha acte izatio with Te ady e’s adva ced automated test platfo ms to help custome s add ess g owi g semico ducto complexity. Togethe , the compa ies will pa t e to adva ce semico ducto test a chitectu es, optimize test i f ast uctu e, a d e ha ce p oductio eadi ess fo existi g a d eme gi g applicatio s, i cludi g high-pe fo ma ce compute (HPC), adva ced packagi g, high-ba dwidth memo y (HBM), a d silico photo ics.

“The semico ducto i dust y is e te i g a pe iod whe e test pe fo ma ce, scalability, a d time-to-ma ket a e becomi g decisive competitive adva tages,” said Mike Slesso , Chief Executive Office of Fo mFacto . “By combi i g Fo mFacto ‘s deep expe tise i device cha acte izatio , p obi g, i te faces, a d p oductio test solutio s with Te ady e’s test platfo ms, we ca help custome s accele ate i ovatio a d move mo e efficie tly f om tech ology developme t to high-volume ma ufactu i g.”

“The most dema di g test challe ges i adva ced packagi g, silico photo ics, a d memo y ca ’t be solved by a si gle compa y,” said G ego y Smith, P eside t a d Chief Executive Office of Te ady e. “By i vesti g i Fo mFacto a d combi i g ou leadi g-edge test platfo ms with Fo mFacto ’s p obe a d i te face expe tise, we’ e buildi g a mo e complete, validated path to p oductio fo ou sha ed custome s, a d ei fo ci g ou commitme t to a ope , i te ope able ecosystem.”

The compa ies believe the collabo atio will accele ate i ovatio ac oss the semico ducto test ecosystem f om wafe to data ce te , expa d oppo tu ities fo joi t custome e gageme t, a d suppo t i c easi g dema d fo adva ced computi g, AI i f ast uctu e, a d ext-ge e atio semico ducto tech ologies.

U de the te ms of the ag eeme t, Te ady e has ag eed to make a $300 millio st ategic equity i vestme t. The t a sactio is subject to customa y closi g co ditio s a d egulato y app ovals.

Safe Ha bo Stateme t

This elease co tai s fo wa d-looki g stateme ts withi the mea i g of the “safe ha bo ” p ovisio s of the fede al secu ities laws, i cludi g stateme ts ega di g the expected be efits a d a ticipated esults of the collabo atio betwee Te ady e a d Fo mFacto , a d the a ticipated timi g a d co summatio of Te ady e’s i vestme t i Fo mFacto . I vesto s a e cautio ed that such fo wa d-looki g stateme ts i volve isks a d u ce tai ties that could cause actual esults to diffe mate ially f om the fo wa d-looki g stateme ts due to k ow a d u k ow isks, u ce tai ties, assumptio s, a d othe facto s. These fo wa d-looki g stateme ts a e ot gua a tees of futu e pe fo ma ce a d speak o ly as of the date he eof, a d Te ady e a d Fo mFacto disclaim a y obligatio to update these fo wa d-looki g stateme ts to eflect futu e eve ts o ci cumsta ces.

About Fo mFacto

Fo mFacto , I c. (Nasdaq: FORM) is a leadi g p ovide of esse tial test a d measu eme t tech ologies alo g the full IC life cycle — f om cha acte izatio , modeli g, eliability, a d desig de-bug to qualificatio a d p oductio test. Semico ducto compa ies ely upo Fo mFacto ’s p oducts a d se vices to accele ate p ofitability by optimizi g device pe fo ma ce a d adva ci g yield k owledge. The Compa y se ves custome s th ough its etwo k of facilities i Asia, Eu ope, a d No th Ame ica. Fo mo e i fo matio , visit www.fo mfacto .com

I vesto Relatio s Co tact fo Fo mFacto , I c.

Sta Fi kelstei I vesto Relatio s(925) 290-4273i @fo mfacto .com

About Te ady e

Te ady e (Nasdaq: TER) desig s, develops, a d ma ufactu es automated test equipme t a d adva ced obotics systems. Its semico ducto a d elect o ics test solutio s spa the full AI device supply chai , f om wafe to data ce te , e abli g custome s to meet the quality a d eliability sta da ds the AI e a dema ds. Its adva ced obotics busi ess deploys i tellige t automatio ac oss ma ufactu i g, logistics, a d data ce te ope atio s fo custome s wo ldwide. Fo mo e i fo matio , visit www.te ady e.com.Te ady e® is a egiste ed t adema k of Te ady e, I c., i the U.S. a d othe cou t ies.

I vesto Relatio s Co tact fo Te ady e, I c.

Amy McA d ewsI vesto Relatio s(978) 370-3945i vesto . elatio s@te ady e.com

Sou ce: Fo mFacto , I c. a d Te ady e, I c.

FORM-F

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