Nexus™ a d Osca ™ chiplets delive high-ba dwidth, lo g- each optical co ectivity with coppe -like eliability a d supply availability, suppo ti g modula co figu atio s f om 1.6 Tbps OSFP to 12.8 Tbps XPO
Eliya I t oduces NuLight™
- Nexus a d Osca a e Eliya ’s fi st NuLight chiplet p oducts that e able optical co ectivity desig ed fo the high-ba dwidth, exte ded each, a d low-powe equi eme ts of la ge AI scale-up a d futu e scale-i systems at coppe eco omics.
- The Nexus octal eve se gea box co ve ts each 212G PAM4 host li k i to 4 x 53G NRZ li ks, whe e each eve se gea box path suppo ts a i depe de t PPM offset, e abli g high- adix scale-up co figu atio s.
- The Osca EIC p ovides the d ive a d TIA elect ical i te faces to mic oVCSEL a d photodiode a ays, which, whe combi ed with the Nexus chip, p ovide a fully etimed slow-a d-wide optical solutio to add ess the “coppe wall” faci g la ge AI systems.
- Modula 1.6Tbps slices scale to 6.4Tbps NPO a d 12.8Tbps XPO co figu atio s, with a a chitectu al path towa d co-packaged optics.
SANTA CLARA, Calif., Oct. 14, 2026 (GLOBE NEWSWIRE) — Eliya , a leade i fou datio al co ectivity p oducts e abli g ext-ge e atio AI compute, memo y, a d etwo ki g systems, today i t oduced the Nexus™ a d Osca ™ NuLight™ chiplets, the wo ld’s fi st 2D mic oVCSEL i te co ect platfo m desig ed to exte d AI scale-up co ectivity beyo d the p actical ba dwidth a d each limits of coppe . The platfo m i cludes Nexus, a 1.6T eve se gea box, a d Osca , a elect ical i te face chip (EIC) that co ects high-speed elect ical i te faces to mic oVCSEL a d photodiode optical a ays.
Togethe , they p ovide scalable buildi g blocks fo li ki g compute esou ces ac oss la ge AI systems, p ovidi g the e ha ced each, low powe , a d high eliability that these systems dema d.
Eliya CEO a d co-fou de Rami u veiled the tech ology at this week’s OCP Summit 2026 with a p ese tatio detaili g the tech ology a chitectu e a d p oducts.
As AI scale-up domai s expa d ac oss multiple acks, coppe co ectio s face i c easi g co st ai ts i delive i g both high ba dwidth a d lo ge each. Eliya ’s NuLight platfo m add esses this “coppe wall” with a high-ba dwidth, high-de sity a chitectu e that sp eads ba dwidth ac oss mo e optical la es ope ati g at lowe data ates tha sta da d PAM4 Se Des co ectio s. Pa allel o – etu -to-ze o (NRZ) optical sig ali g simplifies pe -la e sig al p ocessi g, e abli g mo e powe -efficie t optical li ks tha t aditio al optical i te co ects. The mic oVCSEL-based a chitectu e ta gets a i itial optical each of app oximately 50 mete s, with a desig objective of combi i g optical each with coppe -like eliability, availability, a d ope ati g cha acte istics.
“Scali g AI i f ast uctu e equi es efficie t, eliable co ectivity that eaches beyo d a si gle ack,” said Rami Fa jad ad, co-fou de a d CEO of Eliya . “We have pio ee ed a othe b eakth ough i te co ect tech ology that we c eated f om the g ou d up to solve the coppe wall i the AI data ce te . The i dust y’s apid adoptio of ou p oposed 2D mic oVCSEL i te co ect p oves Eliya is o the ight t ack agai . With ou NuLight chiplet platfo m, custome s ca scale agg egate ba dwidth th ough eusable buildi g blocks. At the same time, o -the-fly la e epai add esses the eliability equi eme ts of la ge AI scale-up a d scale-i etwo ks. This is the ext step i expa di g ou platfo m ac oss the AI co ectivity path.”
Desig ed i TSMC 3 m, Nexus combi es powe -efficie t, co figu able- each 212G PAM4 Se Des with eve se gea box fu ctio ality a d high-speed die-to-die co ectivity. Its compact footp i t suppo ts tight coupli g with optical compo e ts. The eve se gea box dist ibutes each high-speed PAM4 elect ical cha el ac oss fou lowe -speed NRZ cha els, p ovidi g the elect ical b idge to slow-a d-wide optical a ays while suppo ti g fully etimed impleme tatio s.
Nexus i cludes adva ced telemet y with fo wa d e o co ectio (FEC) mo ito i g, te mi atio a d ege e atio , as well as suppo t fo IEEE auto- egotiatio a d host li k t ai i g. These capabilities suppo t li k diag ostics a d ma ageme t i de se optical systems.
Osca compleme ts Nexus with lase -d ive a d TIA elect ical i te faces to ve tical-cavity su face-emitti g lase s (VCSELs) a d photodiode a ays i ve y de se a ays, with state-of-the-a t c osstalk ca cellatio a d heat-ma ageme t schemes.
The platfo m uses pate ted tech ology fo its o -the-fly epai a chitectu e that uses spa e optical la es to p otect active li ks. If a la e deg ades o fails, the a chitectu e edi ects t affic to a spa e la e without i te upti g li k ope atio . Combi ed with li k diag ostics, this capability meets a c itical equi eme t fo AI scale-up a d scale-i etwo ks, whe e i te co ect failu es cause costly dow time a d i te upt massive AI p ocessi g ope atio s.
The NuLight platfo m p ovides a path to co-packaged optics (CPO), whe e futu e ve sio s of Osca will i te face di ectly with host ASICs usi g die-to-die co ectivity. NuLight’s mic oVCSEL a ay app oach d aws o matu e, highly available GaAs lase tech ology a d avoids the eed fo exte al i dium-phosphide lase s i the optical e gi e.
Both Nexus a d Osca chiplets a e sampli g ow.
Eliya Co po atio develops adva ced co ectivity tech ologies that e able ext-ge e atio AI, cloud, a d high-pe fo ma ce computi g systems. Its po tfolio of diffe e tiated i te co ect tech ologies, memo y expa sio , a d chiplet solutio s add esses c itical ba dwidth, powe efficie cy, a d scalability challe ges ac oss mode compute i f ast uctu e.
Eliya ’s tech ologies e able custome s to build highe -pe fo ma ce systems with g eate memo y capacity, imp oved powe a d a ea efficie cy, a d most impo ta tly, highe ba dwidth at lowe cost. Fo mo e i fo matio , visit www.eliya .com.
Mike Sottakmike@wi edisla dp .com +1 650-248-9597
A photo accompa yi g this a ou ceme t is available at https://www.globe ewswi e.com/NewsRoom/Attachme tNg/f7b02bd1-cd04-4b21-9ce9-557817fa564d
