Applied Materials and UCLA Engineering Accelerate Semiconductor Innovation at the EPIC Center

• R&D p og ams to focus o speedi g up the comme cializatio pipeli e so chip tech ology moves f om b eakth ough esea ch to full-scale ma ufactu i g faste
• Collabo ative wo k at the state-of-the-a t facility i Silico Valley pai s UCLA’s semico ducto esea ch st e gth with Applied’s cutti g-edge chipmaki g equipme t a d p ocess i teg atio expe tise

SANTA CLARA, Calif., Oct. 08, 2026 (GLOBE NEWSWIRE) — Applied Mate ials, I c. today a ou ced that the UCLA Samueli School of E gi ee i g will joi the compa y’s EPIC Ce te i Silico Valley as a esea ch pa t e . Togethe with Applied’s scie tists a d e gi ee s, UCLA esea che s will wo k to solve semico ducto mate ials a d i teg atio challe ges with a focus o sho te i g the time it takes to b i g b eakth ough esea ch to comme cializatio .

“As the i dust y aces to b i g ew AI chip tech ologies to ma ket, the EPIC Ce te will play a pivotal ole by co ve i g the i dust y’s top i ovato s i a collabo ative e vi o me t desig ed to accele ate the path f om b eakth ough esea ch to full-scale ma ufactu i g,” said D . P abu Raja, P eside t of the Semico ducto P oducts G oup at Applied Mate ials. “UCLA has a lo g histo y of semico ducto tech ology i ovatio a d Applied looks fo wa d to welcomi g thei esea che s to the EPIC Ce te whe e togethe we will wo k to solve the i dust y’s toughest challe ges.”

The EPIC Ce te aims to accele ate chip R&D by b idgi g the gap betwee t aditio al academic i ovatio a d i dust ial-scale developme t. UCLA esea che s will have access to adva ced chipmaki g tools so that ew ideas ca be validated a d tested i a comme cial fab e vi o me t, the eby sho te i g the path f om co cept to p oductio .

UCLA Samueli b i gs exte sive expe tise ac oss semico ducto devices, mate ials, elect o ics a d computi g. I 1991, He y Samueli co-fou ded B oadcom Co po atio while teachi g at UCLA. The school is also home to the Ce te fo Hete oge eous I teg atio a d Pe fo ma ce Scali g (CHIPS) Lab, which b i gs togethe esea che s ac oss discipli es to adva ce semico ducto tech ologies a d add ess challe ges i chip desig , ma ufactu i g a d i teg atio .

By collabo ati g at the EPIC Ce te , Applied Mate ials a d UCLA will focus R&D p og ams o the semico ducto i dust y’s most c itical challe ges i a eas i cludi g 3D chip scali g, adva ced packagi g a d the discove y of ew mate ials fo imp ovi g e e gy-efficie t AI compute pe fo ma ce. The wo k will compleme t a d exte d the effo ts of UCLA’s Semico ducto Hub, which Applied joi ed as a co-fou di g membe ea lie this yea . Applied’s o goi g commitme t to st e gthe the ties betwee i dust y a d academia is aimed at empowe i g the ext ge e atio of e gi ee s a d esea che s to b i g semico ducto b eakth oughs to ma ket faste .

“Accele ati g semico ducto i ovatio i the ew e a of AI equi es t a sfo mative collabo atio betwee u ive sities a d i dust y pa t e s mo e tha eve befo e,” said Ah-Hyu g “Alissa” Pa k, Ro ald a d Vale ie Suga Dea of UCLA Samueli. “UCLA has a lo g histo y of pio ee i g semico ducto esea ch a d i ovatio , a d this collabo atio builds o that legacy by b i gi g togethe u ive sity esea ch a d i dust y expe tise to adva ce the chip tech ologies that will defi e the futu e of computi g while p epa i g the ext ge e atio of e gi ee s.”

Applied’s ew EPIC (Equipme t a d P ocess I ovatio a d Comme cializatio ) Ce te i Silico Valley ep ese ts the la gest-eve U.S. i vestme t i adva ced semico ducto equipme t R&D. The ce te is desig ed f om the g ou d up to d amatically educe the time it takes to comme cialize b eakth ough tech ologies f om ea ly-stage esea ch to full-scale ma ufactu i g. The facility is o t ack to become ope atio al i 2026. Visit the EPIC Ce te website to lea mo e.

Fo wa d-Looki g Stateme tsThis p ess elease co tai s fo wa d-looki g stateme ts, i cludi g those ega di g Applied’s i vestme t a d g owth st ategies, the developme t of ew mate ials a d tech ologies, i dust y outlook a d tech ology equi eme ts, the pla s a d expectatio s fo the EPIC Ce te , a d othe stateme ts that a e ot histo ical facts. These stateme ts a d thei u de lyi g assumptio s a e subject to isks a d u ce tai ties a d a e ot gua a tees of futu e pe fo ma ce. Facto s that could cause actual esults to diffe mate ially f om those exp essed o implied by such stateme ts i clude, without limitatio : the dema d fo semico ducto s a d custome s’ tech ology equi eme ts; the ability to develop ew a d i ovative tech ologies; the ability to obtai a d p otect i tellectual p ope ty ights i key tech ologies; the ability to achieve the objectives of the EPIC Ce te ; a d othe isks a d u ce tai ties desc ibed i Applied’s fili gs with the Secu ities a d Excha ge Commissio , i cludi g Applied’s most ece t Fo ms 10-K, 10-Q a d 8-K. All fo wa d-looki g stateme ts a e based o ma ageme t’s cu e t estimates, p ojectio s a d assumptio s, a d Applied assumes o obligatio to update them.

About Applied Mate ialsApplied Mate ials, I c. (Nasdaq: AMAT) is the leade i mate ials e gi ee i g solutio s that a e at the fou datio of vi tually eve y ew semico ducto a d adva ced display i the wo ld. The tech ology we c eate is esse tial to adva ci g AI a d accele ati g the comme cializatio of ext-ge e atio chips. At Applied, we push the bou da ies of scie ce a d e gi ee i g to delive mate ial i ovatio that cha ges the wo ld. Lea mo e at www.appliedmate ials.com.

Co tact: Ricky G adwohl (edito ial/media) 408.235.4676Mike Sulliva (fi a cial commu ity) 408.986.7977