News Highlights
- AMD a d Meta collabo ate ac oss CPUs, GPUs, etwo ki g, systems a d softwa e to powe Meta se vices a d AI i f ast uctu e
- AMD Helios ackscale solutio s will powe Meta’s leadi g f o tie models a d se vices
- AMD tech ology is the compute e gi e of choice fo Muse a d AMD tech ologies p ovide Day-0 suppo t fo leadi g Meta models
SANTA CLARA, Calif., Oct. 27, 2026 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today highlighted its deep st ategic pa t e ship with Meta, a ou ci g AMD Helios™ ackscale solutio s a e u i g at Meta, AMD EPYC™ p ocesso s powe Meta’s Muse AI age t, a d AMD tech ologies p ovide Day-0 suppo t fo Meta models i cludi g Muse Spa k Ope a d Muse Glimme .
This builds o yea s of co-desig a d collabo atio betwee the two compa ies ac oss AMD EPYC™ p ocesso s, AMD I sti ct™ GPUs, AMD Pe sa do™ etwo ki g a d AMD ROCm™ AI i f ast uctu e.
“Meta is a st ategic pa t e fo AMD, a d we have built this pa t e ship th ough yea s of deep tech ical collabo atio – f om EPYC p ocesso s powe i g Meta’s i f ast uctu e to I sti ct GPUs a d ope softwa e suppo ti g its AI wo kloads,” said Lisa Su, Chai a d CEO, AMD. “With Helios ow u i g at Meta, we a e taki g that pa t e ship to a ew scale i the supe i tellige ce e a. Togethe , we a e buildi g a d deployi g i f ast uctu e at gigawatt scale a d shapi g futu e ge e atio s of silico , softwa e a d systems to e able Meta’s most ambitious supe i tellige ce models a d se vices.”
“AMD has bee a key pa t e i buildi g out the compute that’s u i g ou f o tie models,” said Ma k Zucke be g, fou de a d CEO, Meta, “We’ e maki g big i vestme ts i the computi g powe that will e able us to b i g pe so al supe i tellige ce to eve yo e, a d AMD plays a impo ta t ole i that.”
AMD Powe i g Meta I f ast uctu e, TodayAMD tech ology powe s Meta’s i f ast uctu e ac oss compute, etwo ki g, systems a d softwa e.
- I itial AMD Helios ackscale solutio s a e i stalled a d bei g tested by Meta o the path to a b oade deployme t i the ea futu e.
- AMD EPYC p ocesso s suppo t the dedicated computi g e vi o me ts behi d Meta’s Muse pe so al AI age t. Meta has deployed millio s of EPYC p ocesso s ac oss multiple ge e atio s a d is a lead custome fo 6th Ge EPYC™ CPUs. The compa ies a e also collabo ati g o futu e ge e atio s, i cludi g “Ve a o.”
- AMD I sti ct GPUs a e cu e tly used i p oductio i Meta’s i f ast uctu e fo t ai i g, a ki g a d ecomme datio e gi es. Meta was also a ea ly defi itio custome fo the AMD I sti ct™ MI450 a chitectu e, a d it will deploy a custom AMD I sti ct GPU that is optimized fo its wo kloads. The collabo atio is also i fo mi g futu e AMD platfo ms, i cludi g AMD I sti ct™ MI500 se ies GPUs a d ext-ge e atio ack-scale systems.
- AMD a d Meta have wo ked togethe to adva ce ROCm th ough PyTo ch to e su e that develope s ca leve age AMD GPUs ight out of the box. As well, AMD delive ed Day-0 suppo t fo Meta’s Muse Spa k Ope models o AMD I sti ct GPUs a d fo Muse Glimme o AMD Ryze ™ AI PCs a d AMD Radeo ™ GPUs.
- AMD a d Meta have expa ded thei softwa e collabo atio to la ge-scale AI t ai i g, optimizi g ecomme datio models o AMD I sti ct MI350X GPUs a d co t ibuti g imp oveme ts to PyTo ch, T ito a d ROCm fo othe develope s to use.
As Meta g ows its AI capabilities, the compa ies a e wo ki g togethe ac oss silico , softwa e a d systems to add ess the dema ds of ope ati g AI i f ast uctu e fo billio s of people. The compa ies have alig ed p oduct oadmaps a d e gi ee i g decisio s a ou d cu e t a d futu e Meta wo kloads, evolvi g yea s of collabo atio i to buildi g a d deployi g i teg ated AI systems at gigawatt scale.
I additio , AMD will i vest $1 billio i Meta’s equity offe i g.
Suppo ti g Resou ces
About AMDAMD (NASDAQ: AMD) d ives i ovatio i high-pe fo ma ce a d AI computi g to solve the wo ld’s most impo ta t challe ges. Today, AMD tech ology powe s billio s of expe ie ces ac oss cloud a d AI i f ast uctu e, embedded systems, AI PCs a d gami g. With a b oad po tfolio of AI-optimized CPUs, GPUs, etwo ki g a d softwa e, AMD delive s full-stack AI solutio s that p ovide the pe fo ma ce a d scalability eeded fo a ew e a of i tellige t computi g. Lea mo e at www.amd.com.
Cautio a y Stateme tThis p ess elease co tai s fo wa d-looki g stateme ts co ce i g Adva ced Mic o Devices, I c. (AMD) such as the collabo atio , expectatio s a d a ticipated be efits of the st ategic pa t e ship with Meta i cludi g the expected b oade deployme t of AMD Helios ack-scale systems i the ea futu e; the compa ies collabo ati g o futu e ge e atio s of AMD EPYC™ p ocesso s i cludi g “Ve a o”; the collabo atio i fo mi g futu e AMD platfo ms i cludi g AMD I sti ct MI500™ se ies GPUs a d ext-ge e atio ack-scale systems; a d the compa ies alig i g p oduct oadmaps a d e gi ee i g decisio s a ou d cu e t a d futu e Meta wo kloads, which a e made pu sua t to the Safe Ha bo p ovisio s of the P ivate Secu ities Litigatio Refo m Act of 1995. Fo wa d-looki g stateme ts a e commo ly ide tified by wo ds such as “would,” “may,” “expects,” “believes,” “pla s,” “i te ds,” “p ojects” a d othe te ms with simila mea i g. I vesto s a e cautio ed that the fo wa d-looki g stateme ts i this p ess elease a e based o cu e t beliefs, assumptio s a d expectatio s, speak o ly as of the date of this p ess elease a d i volve isks a d u ce tai ties that could cause actual esults to diffe mate ially f om cu e t expectatio s. Such stateme ts a e subject to ce tai k ow a d u k ow isks a d u ce tai ties, ma y of which a e difficult to p edict a d a e ge e ally beyo d AMD’s co t ol, that could cause actual esults a d othe futu e eve ts to diffe mate ially f om those exp essed i , o implied o p ojected by, the fo wa d-looki g i fo matio a d stateme ts. Mate ial facto s that could cause actual esults to diffe mate ially f om cu e t expectatio s i clude, without limitatio , the followi g: impact of gove me t actio s a d egulatio s such as expo t egulatio s, atio al-secu ity-based egulatio s, impo t ta iffs, t ade p otectio measu es, a d lice si g equi eme ts; competitive ma kets i which AMD’s p oducts a e sold; the cyclical atu e of the semico ducto i dust y; ma ket co ditio s of the i dust ies i which AMD p oducts a e sold; AMD’s ability to i t oduce p oducts o a timely basis with expected featu es a d pe fo ma ce levels; loss of a sig ifica t custome ; eco omic a d ma ket u ce tai ty; qua te ly a d seaso al sales patte s; AMD’s ability to adequately p otect its tech ology o othe i tellectual p ope ty; u favo able cu e cy excha ge ate fluctuatio s; ability of thi d pa ty ma ufactu e s to ma ufactu e AMD’s p oducts o a timely basis i sufficie t qua tities a d usi g competitive tech ologies; availability of esse tial equipme t, mate ials, compo e ts (such as memo y supply), subst ates o ma ufactu i g p ocesses; ability to achieve expected ma ufactu i g yields fo AMD’s p oducts; AMD’s ability to ge e ate eve ue f om its semi-custom SoC p oducts; pote tial secu ity vul e abilities; pote tial secu ity i cide ts i cludi g IT outages, data loss, data b eaches a d cybe attacks; u ce tai ties i volvi g the o de i g a d shipme t of AMD’s p oducts; AMD’s elia ce o thi d-pa ty i tellectual p ope ty to desig a d i t oduce ew p oducts; AMD’s elia ce o thi d-pa ty compa ies fo desig , ma ufactu e a d supply of mothe boa ds, softwa e, memo y a d othe compute platfo m compo e ts; AMD’s elia ce o Mic osoft a d othe softwa e ve do s’ suppo t to desig a d develop softwa e to u o AMD’s p oducts; AMD’s elia ce o thi d-pa ty dist ibuto s a d add-i -boa d pa t e s; impact of modificatio o i te uptio of AMD’s i te al busi ess p ocesses a d i fo matio systems; compatibility of AMD’s p oducts with some o all i dust y-sta da d softwa e a d ha dwa e; costs elated to defective p oducts; failu e to mai tai a efficie t supply chai as custome dema d cha ges; AMD’s ability to ely o thi d pa ty supply-chai logistics fu ctio s; AMD’s ability to effectively co t ol sales of its p oducts o the g ay ma ket; impact of climate cha ge o AMD’s busi ess; AMD’s ability to ealize its defe ed tax assets; pote tial tax liabilities; cu e t a d futu e claims a d litigatio ; impact of e vi o me tal laws, co flict mi e als elated p ovisio s a d othe laws o egulatio s; evolvi g expectatio s f om gove me ts, i vesto s, custome s a d othe stakeholde s ega di g co po ate espo sibility matte s; issues elated to the espo sible use of AI; est ictio s imposed by ag eeme ts gove i g AMD’s otes, the gua a tees of Xili x’s otes a d the evolvi g c edit ag eeme t; AMD’s ability to satisfy fi a cial obligatio s u de gua a tees, leases a d othe comme cial commitme ts; impact of acquisitio s, joi t ve tu es a d/o i vestme ts o AMD’s busi ess a d AMD’s ability to i teg ate acqui ed busi esses; impact of a y impai me t of the combi ed compa y’s assets; political, legal a d eco omic isks a d atu al disaste s; futu e impai me ts of tech ology lice se pu chases; AMD’s ability to att act a d etai key employees; a d AMD’s stock p ice volatility. I vesto s a e u ged to eview i detail the isks a d u ce tai ties i AMD’s Secu ities a d Excha ge Commissio fili gs, i cludi g but ot limited to AMD’s most ece t epo ts o Fo ms 10-K a d 10-Q.
AMD, the AMD A ow logo, AMD I sti ct, AMD Pe sa do, AMD ROCm, EPYC a d combi atio s the eof a e t adema ks of Adva ced Mic o Devices, I c. Othe ames a e fo i fo matio al pu poses o ly a d may be t adema ks of thei espective ow e s.
CONTACT: Co tact:
Aa o G abei
AMD Commu icatio s
aa o .g abei @amd.com
Liz Sti e
AMD I vesto Relatio s
liz.sti e@amd.com
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