ACM Research’s Ultra ECP ap-p Horizontal Panel Electroplating Tool Receives First Production Order and Evaluation Order from Customers

FREMONT, Calif., Aug. 07, 2026 (GLOBE NEWSWIRE) — ACM Resea ch, I c. (“ACM”) (NASDAQ: ACMR), a leadi g supplie of wafe a d pa el p ocessi g solutio s fo semico ducto a d adva ced packagi g applicatio s, today a ou ced it has eceived o de s fo its p op ieta y Ult a ECP ap-p ho izo tal pa el-level elect oplati g tool f om two adva ced packagi g custome s. This i cludes o de s fo :

• The fi st p oductio o de fo o e 510 × 515 mm Ult a ECP ap-p tool f om a existi g adva ced packagi g custome i mai la d Chi a, with delive y scheduled fo the fi st half of 2027; a d
• A evaluatio o de fo o e 310 × 310 mm Ult a ECP ap-p tool f om a ew leadi g pa el-ma ufactu e custome based i Asia, with delive y scheduled fo the fou th qua te of 2026.

We believe ou Ult a ECP ap-p ep ese ts the wo ld’s fi st comme cial ho izo tal pa el-level coppe depositio system fo la ge pa el ma ket, suppo ti g plati g steps ac oss pilla , bump a d edist ibutio laye (RDL) p ocesses. These o de s b oade ma ket each of the Ult a ECP ap-p, suppo t the expa sio of ACM’s global custome base, a d fu the st e gthe ACM’s positio i the pa el-level adva ced packagi g equipme t ma ket.

“The Ult a ECP ap-p was developed to add ess i c easi g equi eme ts fo plati g u ifo mity, p ocess stability a d p oductio efficie cy as adva ced packagi g moves towa d highe levels of i teg atio a d la ge pa el fo mats,” said D . David Wa g, P eside t a d Chief Executive Office of ACM. “We a e e cou aged by the custome espo se eflected i these o de s a d emai committed to adva ci g ou pa el-level elect oplati g tech ology, suppo ti g custome qualificatio a d volume-p oductio adoptio , a d delive i g competitive solutio s fo adva ced packagi g ma ufactu i g.”The Ult a ECP ap-p featu es ACM’s p op ieta y ho izo tal elect oplati g tech ology a d suppo ts pa el fo mats i cludi g 310 × 310 mm, 510 × 515 mm a d 600 × 600 mm, as well as coppe (Cu), ickel (Ni), ti -silve (S Ag) a d gold (Au) plati g p ocesses. The system featu es a fou -sided seali g d y co tact chuck fo imp oved eliability, i -cell i se fu ctio ality to mi imize chemical c oss-co tami atio betwee diffe e t plati g cells, a d a ho izo tal elect oplati g desig sy ch o izi g a otati g squa e elect ical field with the otati g chuck fo supe io depositio u ifo mity.

Fo wa d-Looki g Stateme ts

Ce tai stateme ts co tai ed i this p ess elease a e ot histo ical facts a d may be fo wa d-looki g stateme ts withi the mea i g of the P ivate Secu ities Litigatio Refo m Act of 1995. Wo ds such as “pla s,” “expects,” “believes,” “a ticipates,” “desig ed,” a d simila wo ds a e i te ded to ide tify fo wa d-looki g stateme ts. Fo wa d-looki g stateme ts a e based o ACM ma ageme t’s cu e t expectatio s a d beliefs a d i volve a umbe of isks a d u ce tai ties that a e difficult to p edict a d that could cause actual esults to diffe mate ially f om those stated o implied by the fo wa d-looki g stateme ts. A desc iptio of ce tai of these isks, u ce tai ties a d othe matte s ca be fou d i fili gs ACM makes with the U.S. Secu ities a d Excha ge Commissio , all of which a e available at www.sec.gov. Because fo wa d-looki g stateme ts i volve isks a d u ce tai ties, actual esults a d eve ts may diffe mate ially f om esults a d eve ts cu e tly expected by ACM. Reade s a e cautio ed ot to place u due elia ce o these fo wa d-looki g stateme ts, which speak o ly as of the date he eof. ACM u de takes o obligatio to publicly update these fo wa d-looki g stateme ts to eflect eve ts o ci cumsta ces that occu afte the date he eof o to eflect a y cha ge i its expectatio s with ega d to these fo wa d-looki g stateme ts o the occu e ce of u a ticipated eve ts.

About ACM Resea ch, I c.

ACM develops, ma ufactu es a d sells semico ducto p ocess equipme t spa i g clea i g, elect oplati g, st ess-f ee polishi g, ve tical fu ace p ocesses, t ack, PECVD, a d wafe – a d pa el-level packagi g tools, e abli g adva ced a d semi-c itical semico ducto device ma ufactu i g. ACM is committed to delive i g customized, high-pe fo ma ce, cost-effective p ocess solutio s that semico ducto ma ufactu e s ca use i ume ous ma ufactu i g steps to imp ove p oductivity a d p oduct yield. Fo mo e i fo matio , visit www.acm .com.

© ACM Resea ch, I c. Ult a ECP ap-p a d the ACM Resea ch logo a e t adema ks of ACM Resea ch, I c. Fo co ve ie ce, the t adema k appea s i this p ess elease without ™ symbol, but that p actice does ot mea ACM will ot asse t, to the fullest exte t u de applicable law, its ights to such t adema ks. All othe t adema ks a e the p ope ty of thei espective ow e s.