ACM Research Expands Ultra C Tahoe into a Wet Processing Platform

FREMONT, Calif., Aug. 07, 2026 (GLOBE NEWSWIRE) — ACM Resea ch, I c. (“ACM”) (NASDAQ: ACMR), a leadi g supplie of wafe a d pa el p ocessi g solutio s fo semico ducto a d adva ced packagi g applicatio s, today a ou ced that it has expa ded its Ult a C Tahoe system i to a multi-p ocess wet p ocessi g platfo m with ew p ocess applicatio s that suppo t a b oade a ge of adva ced wet p ocessi g applicatio s fo logic a d memo y device ma ufactu i g. The expa ded platfo m has bee adopted by multiple leadi g semico ducto ma ufactu e s, demo st ati g its p oductio eadi ess, ve satility a d scalability fo adva ced semico ducto ma ufactu i g.

Leve agi g ACM’s p op ieta y hyb id wet p ocessi g tech ology, the Ult a C Tahoe platfo m i teg ates batch a d si gle wafe p ocesses i to a commo a chitectu e, e abli g multiple adva ced wet p ocesses to be pe fo med o a si gle platfo m. The platfo m fully leve ages the adva tages of batch clea i g, suppo ti g lo ge p ocess times a d educi g chemical co sumptio , while also delive i g the key be efits of si gle-wafe clea i g, i cludi g high pa ticle emoval efficie cy, sig ifica tly educed c oss-co tami atio betwee wafe s, a d p ecise p ocess time co t ol. Recycle mo ito wafe eclaim p ocessi g capabilities we e ece tly added to the Ult a C Tahoe platfo m fo adva ced p ocess ode. The Ult a C Tahoe system leve ages the hyb id a chitectu e to co solidate multiple p ocessi g steps p eviously pe fo med o sepa ate tools i to a si gle hyb id platfo m. This educes wafe t a sfe s betwee tools a d sho te s cycle time, while delive i g imp oved pa ticle emoval pe fo ma ce a d highe th oughput.

“As semico ducto ma ufactu i g becomes mo e complex, custome s eed solutio s that imp ove p oductivity while emai i g flexible e ough to suppo t evolvi g p ocess equi eme ts,” said D . David Wa g, P eside t a d Chief Executive Office of ACM. “Expa di g Tahoe i to a multi-p ocess platfo m demo st ates the ve satility of ou hyb id a chitectu e a d its scalability fo adva ced semico ducto ma ufactu i g. ACM will co ti ue to d ive wo ld-class p ocess pe fo ma ce a d i teg ati g e vi o me tal be efits i to p oduct developme t to help make adva ced semico ducto ma ufactu i g mo e efficie t a d sustai able.”

New Applicatio s a d key Be efits of the Ult a C Tahoe Platfo m:

• Expa ded P ocess Capabilities: The additio of be ch it oge (N2) bubbli g tech ology expa ds the platfo m to suppo t a g owi g po tfolio of adva ced wet p ocessi g applicatio s, i cludi g u ifo m silico it ide ecess etchi g, polysilico etchi g a d etch-back, tu gste ecess p ocessi g, a d silico -ge ma ium ecess etchi g. Togethe with ACM’s p op ieta y SAPS, TEBO, SMT tech ologies, as well as hot IPA d yi g, the expa ded platfo m p ovides i teg ated etchi g, adva ced clea i g, a d d yi g capabilities while mi imizi g damage to patte ed st uctu es.
• Mo e Efficie t Mo ito Wafe Reclaim: Mo ito wafe is used to t ack tool co ditio s a d p ocess stability. Tahoe Recycle mo ito wafe eclaim p ocess suppo ts film a d esidue emoval, clea i g, a d d yi g. It co solidates these steps i to a si gle hyb id platfo m, educi g wafe t a sfe s betwee tools a d sho te i g cycle time. The p ocess also p ovides e ha ced film- emoval capability fo double-side-coated a d thick-film wafe s, imp ovi g eclaimed-wafe clea li ess a d ove all p ocess efficie cy. The Tahoe Recycle applicatio is ow u i g i volume p oductio at custome facilities.
• E ha ced Pa ticle a d Co tami atio Co t ol: The Ult a C Tahoe platfo m has achieved a ave age pa ticle cou t of fewe tha 6 pa ticles at 26 m, with su face metal co tami atio below 1 × 10⁹ atoms/cm².
• E vi o me tal a d Cost Be efits: The Ult a C Tahoe platfo m ca educe sulfu ic acid co sumptio by up to 75%, helpi g lowe high-volume ma ufactu i g costs, educe elated chemical waste a d suppo t custome s’ sustai ability a d ESG goals.

Fo wa d-Looki g Stateme ts

Ce tai stateme ts co tai ed i this p ess elease a e ot histo ical facts a d may be fo wa d-looki g stateme ts withi the mea i g of the P ivate Secu ities Litigatio Refo m Act of 1995. Wo ds such as “pla s,” “expects,” “believes,” “a ticipates,” “desig ed,” a d simila wo ds a e i te ded to ide tify fo wa d-looki g stateme ts. Fo wa d-looki g stateme ts a e based o ACM ma ageme t’s cu e t expectatio s a d beliefs a d i volve a umbe of isks a d u ce tai ties that a e difficult to p edict a d that could cause actual esults to diffe mate ially f om those stated o implied by the fo wa d-looki g stateme ts. A desc iptio of ce tai of these isks, u ce tai ties a d othe matte s ca be fou d i fili gs ACM makes with the U.S. Secu ities a d Excha ge Commissio , all of which a e available at www.sec.gov. Because fo wa d-looki g stateme ts i volve isks a d u ce tai ties, actual esults a d eve ts may diffe mate ially f om esults a d eve ts cu e tly expected by ACM. Reade s a e cautio ed ot to place u due elia ce o these fo wa d-looki g stateme ts, which speak o ly as of the date he eof. ACM u de takes o obligatio to publicly update these fo wa d-looki g stateme ts to eflect eve ts o ci cumsta ces that occu afte the date he eof o to eflect a y cha ge i its expectatio s with ega d to these fo wa d-looki g stateme ts o the occu e ce of u a ticipated eve ts.

About ACM Resea ch, I c.

ACM develops, ma ufactu es a d sells semico ducto p ocess equipme t spa i g clea i g, elect oplati g, st ess-f ee polishi g, ve tical fu ace p ocesses, t ack, PECVD, a d wafe – a d pa el-level packagi g tools, e abli g adva ced a d semi-c itical semico ducto device ma ufactu i g. ACM is committed to delive i g customized, high-pe fo ma ce, cost-effective p ocess solutio s that semico ducto ma ufactu e s ca use i ume ous ma ufactu i g steps to imp ove p oductivity a d p oduct yield. Fo mo e i fo matio , visit www.acm .com.

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