STM32G5 MCUs
STMic oelect o ics eveals adva ced mic oco t olle sfo eal-time powe co t ol i AI datace te s a d obotics
- New STM32G5 se ies b i gs la ge boost i compute pe fo ma ce a d ew featu es
- E ables mo e efficie t powe supplies fo AI datace te s a d bette moto co t ol i obotics
- Robust built-i secu ity i cludes Post-Qua tum C yptog aphy (PQC) suppo t
Ge eva, Novembe 4, 2026 – STMic oelect o ics (NYSE: STM), a global semico ducto leade se vi g custome s ac oss the spect um of elect o ics applicatio s, has evealed the ew STM32G5 se ies of mixed-sig al mic oco t olle s (MCUs). The ew se ies will help develope s build mo e efficie t, i tellige t, a d secu e tech ology fo datace te s, obotics, photovoltaic i stallatio s a d wi d tu bi es, i dust ial d ives, a d comme cial d o es, powe i g the physical AI evolutio .
Pat ick Aidou e, Ge e al Ma age , Ge e al Pu pose a d Automotive Mic oco t olle s Divisio , STMic oelect o ics, explai ed: “This ew ge e atio of mic oco t olle s add esses the challe ge to meet the g owi g e e gy eeds of AI datace te s efficie tly, ealize mo e sophisticated huma oid obots, a d powe mo e complex moto -co t ol systems. With the STM32G5 se ies, ST makes the compute pe fo ma ce eeded fo physical AI accessible a d embeddable to delive imp oveme ts that e ha ce sustai ability, safety, a d secu ity.”
Built with A m® Co tex®-M33 co e, STM32G5 MCUs delive twice the compute pe fo ma ce of the STM32G4 se ies. The e a e also ew a d upg aded pe iphe als that boost speed a d p ecisio fo co t olli g equipme t such as powe supplies a d elect ic moto s. The STM32G5 si gle-co e po tfolio will be e la ged i 2027 with dual-co e p oducts offe i g eve mo e pe fo ma ce a d pe iphe als.
“Digital powe is at the hea t of ou missio to delive i ovative, clea , a d e e gy-efficie t solutio s fo a bette tomo ow, a d it equi es co t ol platfo ms that ca keep pace with i c easi gly complex systems. The STM32G5 b i gs the level of pe fo ma ce a d flexibility eeded fo ext-ge e atio digital-powe applicatio s. The combi atio of p ocessi g powe , i teg ated pe iphe als, a d built-i secu ity makes it a st o g optio fo ou desig s, helpi g delive lowe e e gy losses, a smalle footp i t, a d highe eliability i dema di g AI a d EV applicatio s,” said A dy Hsiao, Se io Commodity Buye , PSBG Mate ials Divisio , Delta Elect o ics.
“I huma oid obotics, dexte ity depe ds o combi i g st e gth, p ecisio , se si g a d eal-time co t ol i a ext emely compact space,” said Paul Tia , Ruiya I tellige t CEO. “The STM32G5 delive s mo e tha twice the pe fo ma ce of the p evious ge e atio , mo e pe iphe al suppo t a d st o ge built-i secu ity eeded to co t ol mo e moto s, espo d faste whe speed a d p ecisio matte , a d i teg ate mo e se so s i to the obotic ha d. Togethe with ST, we’ e b i gi g dexte ous obotic ha ds close to eal-wo ld use, f om facto y automatio to medical labo ato ies, with the goal of maki g eve yday life easie .”
Adva ced featu es fo digital powe a d moto co t ol
The STM32G5 se ies MCUs a e built with the A m Co tex-M33 co e u i g at 280MHz a d i t oduce ew a d upg aded pe iphe als such as a e ha ced high- esolutio time , positio e code , p og ammable logic a ay, a d ha dwa e secu ity.
Imp ovi g e e gy efficie cy a d educi g dema d a e c itical i today’s datace te s, especially whe e AI accele ato s a e co ce t ated. The i c easi g speed a d pe fo ma ce of the latest GPU cluste s is d ivi g ack powe towa ds 1 MW a d the la gest datace te s could dema d ove 2 GW of peak powe by 2030. At this scale, eve small efficie cy gai s ca educe e e gy losses a d cooli g dema d. With the high- esolutio time , equipme t make s ca impleme t p ecisio algo ithms to eco figu e powe -supply u its dy amically fo maximum efficie cy as the se ve s’ powe dema ds cha ge with thei wo kloads. Also, with this sha pe timi g, the STM32G5 ca ha dle the highe switchi g f eque cies i powe supplies built with wide-ba dgap silico ca bide (SiC) a d gallium it ide (GaN) semico ducto s.
Huma oid obotics b i gs complex moto -co t ol equi eme ts i cludi g simulta eous multi-axis d ivi g, ofte with high cu e t delive y to p oduce high to que, a d always with fast espo se to e su e smooth, atu al moveme t. Fi e co t ol is eeded whe e p ecisio takes p io ity i mecha isms such as the ha d a d fi ge s, with as ma y as 20 moto s i o e ha d. This is o e of the most visible applicatio s of physical AI, whe e the STM32G5’s adva ced capabilities ca expa d the ma ket fo affo dable, useful huma oid obots.
Adva ced safety a d secu ity
By i t oduci g the ew PLAy p og ammable logic a ay, STM32G5 MCUs let develope s impleme t special custom fu ctio s i obust a d eliable custom ha dwa e educi g the eed fo exte al glue logic.
State-of-the-a t secu ity, i cludi g p ovisio i g capability, which is a added value of the STM32G5 a d a impo ta t adva tage fo use i datace te s, suppo ts cu e t a d upcomi g complia ce equi eme ts. ST combi es the Co tex-M33’s A m T ustZo e® IP with p op ieta y STM32T ust featu es that i clude a immutable Root of T ust (STiRoT) fo secu e boot a d secu e fi mwa e update. The e is also a adva ced c yptog aphic e gi e that suppo ts the latest algo ithms, i cludi g ST’s PQC lib a ies, softwa e p otectio , secu e sto age fo se sitive data such as c yptog aphic keys, tampe detectio , side-cha el attack esista ce, a d suppo t fo life cycle secu ity ma ageme t.
Exte ded ecosystem
The STM32G5 be efits f om dedicated ecosystems fo developi g digital powe a d moto co t ol applicatio s. Comp isi g ha dwa e, softwa e, docume tatio , a d t ai i g esou ces, they help accele ate developme t a d educe time to ma ket.
The STM32G5 se ies is i cluded i the latest-ge e atio STM32CubeMX2 developme t tool, which suppo ts ew wo kflows a d adva ced featu es such as live code p eviews that save time a d give i sta t feedback. I additio , a optimized g aphical use i te face, ew featu es fo co figu i g clocks a d pi out, a d o li e docume tatio simplify ma agi g depe de cies a d keepi g p ojects up to date.
The STM32G5 se ies also be efits f om the ew STM32Cube ha dwa e abst actio laye (HAL2) offe i g full access to all the ich STM32G5 ha dwa e featu es with sig ifica t memo y footp i t optimizatio .
Fu the tech ical featu es:
- Co tex-M33 co e (420 DMIPS/1136 Co eMa k® @ 280MHz)
- Mo e ha dwa e accele ato s: I/D cache, outi e booste
- P og ammable logic a ay (PLAy) pe mits o -chip custom ha dwa e
- Fi st MCU with ST’s e ha ced 12-cha el high- esolutio time , ideal fo digital powe supplies
- Moto -co t ol time s, positio e code (POSENC)
- Rich a d adva ced a alog pe iphe als, i cludi g 12-bit a alog-to-digital co ve te (ADC), ope atio al amplifie , 12-bit digital-to-a alog co ve te (DAC), ult a-fast compa ato s
- STM32 Nucleo boa d co tai i g STM32G5-512K i LQFP64 (NUCLEO-G564RE)
- Moto Co t ol Discove y Kit (B-G564E-MC1S)
- Digital Powe Discove y Kit (B-G564E-DPOW1)
- Digital powe lib a ies (X-CUBE-DPOWER)
- Moto co t ol softwa e developme t kit (X-CUBE-MCSDK)
- LQFP package available i two va ia ts, i cludi g the mally-e ha ced exposed pad va ia t to sustai adva ce missio p ofiles ( equi ed fo datace te powe applicatio s)
STM32G5 MCUs a e i p oductio ow, comp isi g pe fo ma ce a d high- esolutio p oduct li es, with o -chip Flash f om 64Kbytes to 512Kbytes, a d package styles f om a small QFN32 to the LQFP128. P ices sta t f om $1.0340 fo o de s of 10,000 pieces.
Fo mo e i fo matio , please go to www.st.com/stm32g5
STM32 is a egiste ed a d/o u egiste ed t adema k of STMic oelect o ics I te atio al NV o its affiliates i the EU a d/o elsewhe e. I pa ticula , STM32 is egiste ed i the US Pate t a d T adema k Office.
About STMic oelect o ics
At ST, we a e 49,000 c eato s a d make s of semico ducto tech ologies maste i g the semico ducto supply chai with state-of-the-a t ma ufactu i g facilities. A i teg ated device ma ufactu e , we wo k with mo e tha 200,000 custome s a d thousa ds of pa t e s to desig a d build p oducts, solutio s, a d ecosystems that add ess thei challe ges a d oppo tu ities, a d the eed to suppo t a mo e sustai able wo ld. Ou tech ologies e able sma te mobility, mo e efficie t powe a d e e gy ma ageme t, a d the wide-scale deployme t of cloud-co ected auto omous thi gs. We a e o t ack to be ca bo eut al i all di ect a d i di ect emissio s (scopes 1 a d 2), p oduct t a spo tatio , busi ess t avel, a d employee commuti g emissio s (ou scope 3 focus), a d to achieve ou 100% e ewable elect icity sou ci g goal by the e d of 2027. Fu the i fo matio ca be fou d at www.st.com.
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