ThinkPalm Attends CES 2026
ThinkPalm Technologies Pvt. Ltd., a global digital engineering company, showcased its latest technology innovations at CES 2026 in Las Vegas. The company presented its work in Agentic AI, its industrial intelligence platform NetvirE, and advanced Telecom Product Engineering Services at Booth No. 50570 at the Venetian Expo Hall.
ThinkPalm (https://thinkpalm.com/) was represented at the event by Manoj KP, Founder, Managing Director and CEO, Rejish M Unni, Founder and Director of Sales and Marketing, and Adarsh Sukumaran, Innovation and Solutions Strategist.
Throughout the event, ThinkPalm connected with global technology leaders, partners, and visitors, sharing how enterprises can build smarter, more connected, and efficient systems across industries.
Demonstrating the Power of Agentic AI
At CES 2026, ThinkPalm demonstrated how Agentic AI is changing the way software is built and managed. The team showcased AI-driven agents supporting software development, testing, and deployment workflows.
Agentic AI solutions (https://thinkpalm.com/services/agentic-ai-solutions/) help teams deliver software faster while maintaining quality by embedding intelligence across the entire software development lifecycle.
NetvirE Enables Smarter Industrial Operations
Another major highlight at the booth was NetvirE (https://thinkpalm.com/products/netvire/) , ThinkPalm’s unified industrial IoT platform designed for complex and large-scale operations.
NetvirE brings data from connected assets, systems, and devices into one platform. It supports real-time monitoring, smart dashboards, asset tracking, and automated alerts, helping teams gain better visibility and control.
Visitors also explored how NetvirE enables digital twins, predictive maintenance using Gen-AI, and edge plus cloud architectures for modern industrial environments.
Strengthening Telecom Product Engineering Capabilities
ThinkPalm also highlighted its expertise in Telecom Product Engineering, with a focus on building reliable and scalable connectivity solutions.
The showcase included experience across next-generation technologies such as Wi-Fi 7, Wi-Fi 6E, low-power wireless, BLE, Thread, Matter, and RDK-B. These capabilities support the development of telecom products that deliver consistent performance across evolving network environments.
Industry Engagement and Future Outlook
During CES 2026, the ThinkPalm team engaged in discussions with enterprises, manufacturers, OEMs, and technology partners. Conversations focused on practical AI adoption, connected platforms, and building future-ready products that deliver real business value.
The event reinforced the importance of unified systems, intelligent automation, and scalable architectures in driving digital transformation.
ThinkPalm Technologies Pvt. Ltd.
B-1,1st floor, Athulya Building,
Infopark-SEZ, Infopark Kochi P.O.,
Kochi, Kerala 682042
Phone number- +91-484.410.4100
About ThinkPalm Technologies
ThinkPalm Technologies Pvt. Ltd. is a global digital engineering and product development company that supports enterprises in creating, developing, and scaling advanced technology solutions. The company has strong expertise in industrial IoT, agentic AI, telecom product engineering, and software development.
ThinkPalm has offices in Kochi, Trivandrum, and Chennai in India, and serves customers across the US, Europe, the UK, and the Asia-Pacific regions. The company works with industries including telecom, manufacturing, utilities, and enterprise.
For more information, visit http://www.thinkpalm.com.
This release was published on openPR.
