Compa y to Highlight OCP Rack-Based I ovatio s E abli g Scale-Up, Scale-Out, a d Scale-Ac oss Netwo ks Ac oss AI Cluste s
PALO ALTO, Calif., Oct. 08, 2026 (GLOBE NEWSWIRE) — B oadcom I c. (NASDAQ: AVGO), a global tech ology leade that desig s, develops, a d supplies semico ducto a d i f ast uctu e softwa e solutio s, today a ou ced it is set to p ese t its latest i ovatio s i scale-up, scale-out, a d scale-ac oss AI etwo ki g at the 2026 Ope Compute P oject (OCP) Global Summit. Ru i g f om Octobe 12–15 i Sa Jose, B oadcom will featu e Ethe et switches, NICs, PCIe compo e ts a d i teg ated optics to powe Ope Rack Ve sio 3 (ORV3) solutio s fo scali g AI i f ast uctu e.
Featu ed i ovatio s i clude Tomahawk® 6, Tomahawk Ult a, a d Je icho 4 Ethe et switches, the Tho Ult a 800G a d Tho 2 400G AI Ethe et NICs, a d B oadcom’s thi d-ge e atio TH6-Davisso Co-Packaged Optics (CPO) — a po tfolio built to meet the expo e tial ba dwidth dema ds of f o tie AI models as they g ow i scale a d complexity.
“Togethe , the OCP Commu ity a d B oadcom have a lo g histo y of d ivi g computi g at massive scale, a d this yea ’s eve t theme—’Scali g I ovatio fo the AI E a’—u de sco es the g owi g impo ta ce of ope collabo atio . AI i f ast uctu e dema ds a e scali g faste tha a ythi g ou i dust y has see , a d Ethe et is the fou datio that makes that g owth sustai able. With ou i dust y-leadi g po tfolio of etwo ki g solutio s a d ew b eakth oughs i i teg ated optics, B oadcom is givi g AI labs, hype scale s a d cloud p ovide s the ba dwidth a d powe efficie cy they eed to scale-up, scale-out, a d scale-ac oss ext-ge e atio AI cluste s,” said Cha lie Kawwas, Ph. D., p eside t, Semico ducto Solutio s G oup, B oadcom.
“The cu e t pace of AI data ce te i f ast uctu e developme t depe ds o a ope ecosystem that ca suppo t apid i ovatio . The OCP Fou datio with its u ique collabo ative model, Chip-to-G id visio , a d la ge collabo ative commu ity is the pe fect place to u tu e ope ecosystems fo the apidly evolvi g AI data ce te i dust y. B oadcom has bee a lo gsta di g co t ibuto to OCP, a d we app eciate the tech ologies a d co t ibutio s they’ e b i gi g to this yea ‘s Summit that leve age the ope collabo atio s of the OCP Commu ity, f om ORV3 ack-based desig s to adva ces i ORW (wide) acks a d ew wide co-packaged optics, that eflect exactly the ki d of collabo atio ou Commu ity eeds to solve the ba dwidth a d efficie cy challe ges faci g AI data ce te s at scale,” said Geo ge Tchapa ia , CEO, Ope Compute P oject Fou datio .
At this yea ’s summit, Asad Khamisy, Ph. D., se io vice p eside t a d ge e al ma age , B oadcom’s Co e Switchi g G oup, will delive a key ote titled “Scali g AI I f ast uctu e Th ough Ope I ovatio ” o Mo day, Octobe 12, 2026, at 5:30 p.m. Pacific Time i the South Hall of the Sa Jose Co ve tio Ce te (SJCC). His p ese tatio will p ese t B oadcom’s visio fo scali g AI i f ast uctu e, highlighti g b eakth oughs i ope etwo ki g, optical i te co ects, a d modula ack desig s fo cluste s of ove 100,000 accele ato s. Khamisy will also add ess challe ges i buildi g switch ha dwa e fo AI etwo ks a d sha e i ovatio s that delive g eate ba dwidth, eliability, a d efficie cy fo dist ibuted AI computi g. To lea mo e about Khamisy’s upcomi g key ote, click he e to ead his blog, “The Futu e of AI I f ast uctu e: Why Ethe et a d Optical Co ectivity A e Redefi i g Scale-up Netwo ks.”
Th oughout the co fe e ce, B oadcom expe ts will add ess the c itical tech ical challe ges a d b eakth oughs i buildi g ext-ge e atio AI i f ast uctu e.
224G AECs fo AI Data Ce te s: Exte di g Reach, E ha ci g Telemet y, a d Redefi i g Coppe Co ectivity , Rajesh A apillai, B oadcom, a d Clay Mille , Molex, Mo day Octobe 12, 12:00pm-12:20pm | SJCC – Co cou se Level – 210AE.Desig i g the Next AI Fab ic: Whe Compute Meets Optics, Ma ish Mehta, B oadcom, Ta eq Bustami, Celestica, a d Bi bi Gua , Ope AI, Mo day, Octobe 12, 1:15pm-1:35pm | SJCC – Co cou se Level – 210CG.Cu e t Activities i the Ope Cluste Desig s fo AI St ategic I itiative , Lowell Lamb, B oadcom, a d Lo e Staley, Celestica, Tuesday, Octobe 13, 1:25pm-1:40pm | SJCC – Co cou se Level – 220B.Usi g SPDM fo PLDM Fi mwa e Updates: Autho izatio Policy a d Measu eme t Ma ifest Capabilities , B ett He i g, B oadcom, Pat ick Capo ale, Le ovo, a d Scott Phuo g, Mic osoft, Tuesday, Octobe 13,4:00pm-4:20pm| SJCC – Lowe Level – LL21BC.E abli g AI Netwo ki g @ Scale with Multi-path Reliable Co ectio s (MRC) , E ic Spada, B oadcom, a d Guoha Lu, Ope AI, Wed esday Octobe 14, 9:45am – 10:05am | SJCC – Co cou se Level – 220B.Netwo k Co figu atio s fo Optical AI Fab ics i cludi g MRC a d SRv6 , Mohammad Ha if, B oadcom, a d A iha t Jai , A ista Netwo ks, Wed esday, Octobe 14, 10:10am-10:30am | SJCC – Co cou se Level – 220B.SUE-T – A Ethe et t a spo t fo Scale-Up Netwo ki g , Ka e Sch amm, B oadcom, a d Tom Emmo s, A ista Netwo ks, Wed esday, Octobe 14, 1:00pm-1:15pm | SJCC – Co cou se Level – 220B.CPO, OCI (OCP Special Focus: Photo ics) , Rajiv Pa choly, B oadcom, Wed esday, Octobe 14, 3:15pm-3:30pm | SJCC – Co cou se Level – 210AE.Sta da ds a d Futu e Tech ologies (OCP Special Focus: Photo ics) , Rajiv Pa choly, B oadcom, Natha T acy, TE Co ectivity, Ra g-Che Yu, Te aHop, A dy Bechtolsheim, A ista Netwo ks, Vlad Kozlov, Lightcou ti g (Mode ato ), Wed esday, Octobe 14, 4:40pm-5:00pm| SJCC – Co cou se Level – 210AE.Deep Buffe s: The Esse tial Fou datio fo Scalable AI T ai i g a d I fe e ce I f ast uctu e , Gola Schuzki , B oadcom, a d Hugh Holb ook, A ista Netwo ks, Thu sday, Octobe 15, 12:30pm-12:45pm| SJCC – Co cou se Level – 210AE.P ecisio Time fo AI I f ast uctu e: Deployi g PTP Bou da y Clocks at Scale , Bhaska Chi i, B oadcom, a d Vik am Cha d a, Nokia, Thu sday, Octobe 15, 12:50pm-1:05pm | SJCC – Lowe Level – LL21BC.
At OCP, B oadcom will pa t e with 15 plus compa ies to showcase its latest solutio s ac oss the show floo , u de sco i g its leade ship i shapi g the futu e of AI i f ast uctu e.
Accto /Edgeco e Netwo ks will featu e Tomahawk 6 demos, Expo Hall 3, Booth D1.Alpha Netwo ks will showcase live demos with thei Tomahawk 6 liquid cooled solutio , Expo Hall 3, Booth D9.Celestica will display Tomahawk 6-Davisso 102.4T CPO a d Tomahawk 6 demos, Expo Hall 2, Booth C2.Delta Elect o ics will showcase Tomahawk 6-Davisso 102.4T CPO, Expo Hall 3, Booth D5.Micas Netwo ks will showcase Tomahawk 6-Davisso 102.4T CPO, Expo Hall 3, Booth E5.
To lea mo e about these a d othe tech ical speaki g sessio s, joi t pa t e demo st atio s, tech ology showcases, key B oadcom ews, a d othe activities at 2026 OCP Global Summit, please click he e.
B oadcom, the pulse logo, a d Co ecti g Eve ythi g a e amo g the t adema ks of B oadcom. The te m “B oadcom” efe s to B oadcom I c., a d/o its subsidia ies. Othe t adema ks a e the p ope ty of thei espective ow e s.
