- Volkswage G oup a d NXP Semico ducto s, o e of the wo ld’s leadi g automotive semico ducto compa ies, a e expa di g thei coope atio i automotive semico ducto tech ology
- NXP has bee selected as a st ategic tech ology pa t e , p ovidi g its mic oco t olle s (MCUs) as a commo buildi g block fo G oup’s futu e zo al softwa e-defi ed vehicle a chitectu e
- Commo MCU tech ology educes complexity a d suppo ts scalable deployme t ac oss b a ds a d vehicle segme ts
WOLFSBURG, Ge ma y, Oct. 26, 2026 (GLOBE NEWSWIRE) — Volkswage G oup a d NXP Semico ducto s today a ou ced ahead of the I te atio al Supplie s Fai (IZB) i Wolfsbu g that they had ag eed o a st ategic pa t e ship. NXP’s S32K5 family of mic oco t olle s (MCUs) is i te ded to se ve as a impo ta t buildi g block of Volkswage G oup’s futu e softwa e-defi ed vehicle (SDV) a chitectu e, suppo ti g zo al co t ol ac oss all b a ds a d vehicle segme ts. The fi st vehicle featu i g the ew a chitectu e is pla ed fo 2027.
Mode vehicles must suppo t a g owi g umbe of digital fu ctio s. Ma agi g these fu ctio s th ough sepa ate elect o ic co t ol u its (ECUs) i c eases complexity i developme t a d pa ts ma ageme t a d limits scalability. Zo al a chitectu e add esses this challe ge by usi g powe ful mic oco t olle s to co solidate multiple vehicle fu ctio s i to fewe ECUs.
Next to high-pe fo ma ce p ocesso s that p ovide the ce t al computi g powe a d make complex decisio s fo AI-e abled fu ctio s such as automated d ivi g a d adva ced i fotai me t, the S32K5 MCUs se ve as the co e p ocesso s of the vehicle’s zo al co t olle s. They co ect se so s a d actuato s, collect a d p ocess data f om specific a eas of the vehicle, a d ma age fu ctio s such as lighti g, body, comfo t, chassis a d safety systems. These capabilities p ovide the fou datio fo the ce t al computi g platfo m to u AI algo ithms a d pe fo m adva ced fu ctio s.
NXP’s S32K5 MCUs e able fu ctio s that p eviously equi ed sepa ate chips a d ECUs to be co solidated withi zo al co t olle s, educi g ha dwa e complexity. They a e i te ded to se ve as a commo buildi g block fo the futu e zo al SDV a chitectu e developed by Rivia a d Volkswage G oup Tech ologies, LLC (RV Tech), the joi t ve tu e betwee Volkswage G oup a d Rivia . The a chitectu e is i te ded to be used ac oss both compa ies’ vehicles, e abli g b a d-specific featu es a d expe ie ces.
The pa t e ship is pa t of Volkswage G oup’s b oade semico ducto st ategy. Th ough di ect, lo g-te m pa t e ships with leadi g semico ducto compa ies, Volkswage G oup combi es its automotive expe tise with cutti g-edge chip tech ology to st e gthe supply esilie ce a d joi tly shape key tech ologies fo futu e vehicle ge e atio s. The app oach suppo ts the G oup Ta get Pictu e 2030 a d aims to leve age sy e gies ac oss b a ds a d egio s a d ha mo ize key tech ologies.
NXP a d the NXP logo a e t adema ks of NXP B.V. All othe p oduct o se vice ames a e the p ope ty of thei espective ow e s. All ights ese ved. © 2026 NXP B.V.
A photo accompa yi g this a ou ceme t is available at https://www.globe ewswi e.com/NewsRoom/Attachme tNg/8f53a109-f422-4bbf-ac41-155096ef6903
CONTACT: Fo mo e i fo matio , please co tact:
Ve o ika Klofcova
Co po ate Commu icatio s Spokespe so P ocu eme t
+420 731 296 057
ve o ika.klofcova@skoda-auto.cz
Jo as Kulawik
Co po ate Commu icatio s Spokespe so P oduct & Tech ology, Digitalizatio
+49 (0) 152 2945 2616
jo as.alexa de .kulawik@volkswage .de
Ame icas a d Eu ope
Phoebe F a cis
Tel: +1 737-274-8177
Email: phoebe.f a cis@ xp.com
Asia Pacific
Je y YC Che
Email: je y.yc.che @ xp.com
