As the global photo ics commu ity gathe s i Málaga, Spai this week fo the 52 d Eu opea Co fe e ce o Optical Commu icatio a d the Global Photo ics Eco omic Fo um, Sca ti el evealed its ew exte al lase small fo m-facto pluggable (ELSFP) module that p ovides a ce t alized, se viceable light sou ce fo co-packaged optics (CPO) systems i existi g a d ext-ge e atio AI data ce te s a d photo ics-e abled AI a d cloud i f ast uctu e.
Sca ti el’s diffe e tiated ELSFP tech ology is built a ou d its co e photo ic i teg ated ci cuit (PIC), a two-dime sio al photo ics platfo m desig ed to imp ove the speed, powe efficie cy, a d eco omics of high-speed optical co ectivity.
“The PIC tech ology at the ce te of the module is the same co e tech ology that fuels ou FMCW lida a chitectu e,” said Gle DeVos, Chief Executive Office of Mic oVisio . “Si ce acqui i g Sca ti el, ou team has co ti ued to efi e a d validate this tech ology. Its applicatio to AI data ce te co ectivity a d photo ics-e abled cloud computi g demo st ates the b oade value of that acquisitio a d ou ability to expa d ou tech ology i to ew ma kets without diluti g ou st ategic focus o equi i g sig ifica t ew i vestme t.”
AI a d high-pe fo ma ce computi g a e d ivi g u p ecede ted dema d fo data moveme t betwee p ocesso s, se ve s, a d acks. As compute de sity a d ba dwidth equi eme ts i c ease, the powe , efficie cy a d eco omics of movi g that data a e becomi g i c easi gly impo ta t co st ai ts fo ext-ge e atio data ce te s a d photo ics-e abled cloud computi g.
Sca ti el’s ELSFP module is desig ed to add ess that challe ge by ce t alizi g a d optimizi g the lase sou ce used fo high-speed optical co ectio s. Its a chitectu e educes complexity a d powe co sumptio while suppo ti g the high-ba dwidth co ectivity equi ed by i c easi gly powe ful AI i f ast uctu e.
“The AI i f ast uctu e challe ge is ‘t just about computi g powe ; it’s also about movi g e o mous amou ts of data quickly a d efficie tly,” DeVos said. “Ou photo ics tech ology gives us a oppo tu ity to add ess that challe ge at a fu dame tal level while exte di g tech ology we have al eady developed i to a sig ifica t ew ma ket.”
The photo ics i t oductio is pa t of a b oade expa sio of Mic oVisio tech ology i to i tellige t i f ast uctu e applicatio s. Mic oVisio is cu e tly i discussio s with seve al pote tial lice sees a d developme t pa t e s as it evaluates efficie t cha els to accele ate comme cializatio of the tech ology.
Mic oVisio is defi i g the ext ge e atio of lida -based pe ceptio solutio s fo i dust ial, secu ity & defe se, a d automotive ma kets. As the i dust y moves beyo d p oof of co cept towa d value, deployme t, a d comme cializatio , Mic oVisio delive s i teg ated ha dwa e a d softwa e solutio s desig ed fo eal-wo ld pe fo ma ce, automotive-g ade eliability, a d eco omic scalability. With e gi ee i g ce te s i the U.S. a d Ge ma y, Mic oVisio leads the i dust y i depth a d b eadth of its po tfolio, with both sho t- a d lo g- a ge lida solutio s, featu i g solid-state se so s with va yi g wavele gths, adva ced se so a chitectu es, desig -to-cost e gi ee i g, a d ope softwa e solutio s.
Fo mo e i fo matio , visit the compa y’s website at www.mic ovisio .com, o Facebook at www.facebook.com/mic ovisio i c, a d Li kedI at https://www.li kedi .com/compa y/mic ovisio /.
Mic oVisio , Mic oVisio HALO, IRIS, MOVIA, MOSAIK, a d SENTINEL a e t adema ks of Mic oVisio , I c., a d SCANTINEL is a t adema k of Sca ti el GmbH, i the U ited States a d othe cou t ies. All othe t adema ks a e the p ope ty of thei espective ow e s.
Jeff Ch iste se Da ow Associates I vesto Relatio s
Heidi Davidso – Fo Mic oVisio
