ACCELERATING PHOTONICS-SOI MOMENTUM
DRIVES STRONG Q1’27 REVENUE, UPGRADED OUTLOOK
AND PUBLICATION AHEAD OF SCHEDULE
Q1’27 eve ue eached €113m, up 23% yea -o -yea at co sta t cu e cy a d scope, above guida ce of a ou d 15% Q1’27 eve ue g owth p ima ily eflects accele atio i Photo ics-SOI, fo high-speed optical t a sceive s i AI Data Ce te s, with sales doubli g yea -o -yea 300mm SOI fab i Si gapo e is ow qualified fo high volume ma ufactu i g of Photo ics-SOI with fi st custome s, e abli g the G oup’s ability to captu e accele atio i dema d. Soitec is wo ki g o qualifyi g mo e custome s Q2’27 eve ue is expected to g ow mo e tha 30% yea -o -yea , at co sta t cu e cy a d scope, otably sustai ed by a accele atio i Photo ics-SOI dema d Soitec’s visibility o Photo ics-SOI e d dema d a d its ability to execute a e imp ovi g. Assumi g o mate ial dis uptio i the AI ma ket, Photo ics-SOI FY27 eve ue is expected to mo e tha double the slightly above $100m ge e ated i FY26 P ojected FY27 CAPEX cash-out is co fi med a ou d €100m
Soitec (Eu o ext Pa is), a wo ld leade i the desig a d ma ufactu i g of i ovative semico ducto mate ials, today a ou ced u audited co solidated eve ue fo the fi st qua te of fiscal yea 2027 (pe iod e ded o Ju e 28th, 2026).
Si ce the sta t of Q2’27, the G oup has see fu the accele atio i custome dema d fo Photo ics-SOI, as well as the satisfacto y esults of the actio pla i itiated to i c ease its p oductio output. As visibility i the Photo ics-SOI busi ess imp oved mate ially, Soitec published its Q1’27 eve ue ahead of schedule.
Visibility o Photo ics-SOI is ow good, as we co ti ue to sig Capacity Rese vatio Ag eeme ts with multiple custome s ove seve al yea s. We have successfully qualified ou Si gapo e 300mm SOI fab with fi st custome s. With highe dema d a d imp oved executio , I am co fide t i the outlook fo the yea , as we adva ce additio al custome qualificatio s.
We a e t acki g to the pla we set out. With the compa y positio ed o a cash ge e atio path, eve ue is ow back to g owth, pavi g the way fo imp oved p ofitability.”
Q1’27 eve ue by e d-ma ket
| (Eu o millio s) | Mobile Commu icatio s | 43 | Edge & Cloud AI | 44 | Automotive & I dust ial | 5 | 92 |
Mobile Commu icatio s eve ue eached €39 millio i Q1’27, dow 10% yea -o -yea at co sta t cu e cy a d scope. I a co st ai ed sma tpho e ma ket, POI adoptio co ti ues to gai mome tum, while RF-SOI custome s make fu the p og ess i educi g excess i ve to ies.
Edge & Cloud AI eve ue eached €65 millio i Q1’27, up 46% yea -o -yea at co sta t cu e cy a d scope.
This st o g pe fo ma ce was p ima ily d ive by Photo ics-SOI, with sales doubli g yea -o -yea , d ive by volumes. Dema d emai s u de pi ed by the g owi g eed fo high-speed, high-ba dwidth optical co ectivity i AI data ce te i f ast uctu e, i cludi g pluggable t a sceive s a d Nea -Package Optics (NPO), as well as the i dust y qualificatio of Co-Packaged Optics (CPO) a chitectu es.
Soitec co ti ues to st e gthe its medium-te m visibility i
Automotive & I dust ial eve ue eached €10 millio i Q1’27, up 108% yea -o -yea at co sta t cu e cy a d scope, albeit f om a low compa iso base, as some custome s co ti ued to wo k th ough excess i ve to ies. The G oup has good visibility fo FY27, suppo ted by a lo g-te m ag eeme t with a key custome .
Automotive
Soitec expects Q2’27 eve ue to be up mo e tha 30% yea -o -yea , otably sustai ed by a accele atio i Photo ics-SOI.
Looki g ahead, the mome tum behi d Photo ics-SOI keeps buildi g. As AI a chitectu es p og essively adopt optical t a sceive s, SOI delive s highe ba dwidth, lowe late cy a d bette e e gy efficie cy, suppo ti g the accele atio i dema d Soitec has wit essed ove the past seve al mo ths. Beyo d cu e t deployme ts, the i dust y is ow p epa i g the t a sitio to scale-up a chitectu es. This t a sitio is expected to occu th ough successive phases. Photo ics-SOI tech ology has al eady demo st ated its ability to add ess diffe e t scale-up co figu atio s, such as pluggable t a sceive s, Nea -Package Optics (NPO) a d Co-Packaged Optics (CPO).
As the i dust y is e te i g the scale-up e a with mass p oductio of AI I te co ects, Soitec is actively ceme ti g its leade ship i the Photo ics value chai a d wo ki g o captu i g the steep accele atio i custome dema d. I this co text, Soitec’s visibility o Photo ics-SOI e d-dema d a d the G oup’s ability to execute a e imp ovi g. Assumi g o mate ial dis uptio i the AI ma ket, Photo ics-SOI FY27 eve ue is expected to mo e tha double the slightly above $100m ge e ated i FY26.
This visibility is u de pi ed by accele ati g adoptio ac oss AI data ce te s, expa di g multi-yea custome commitme ts to secu e capacity with cash deposits, a st o g sig al of e gageme t to secu i g lo g-te m supply with Soitec. Fu the volumes a e u de active discussio .
Fo FY27, we expect co t asti g dy amics ac oss ou e d ma kets. I Mobile Commu icatio s, p og ess i POI should be offset by the o goi g custome i ve to y co ectio i RF-SOI, i a challe gi g sma tpho e ma ket. I Automotive, the good visibility stemmi g f om a custome lo g-te m ag eeme t mea s that a y ea ly sig s of e d-ma ket ecove y would ot be expected to be efit the G oup this yea . By co t ast, Edge & Cloud AI mome tum co ti ues to imp ove, d ive by accele ati g dema d fo Photo ics-SOI.
P ojected FY27 CAPEX cash-out is co fi med a ou d €100m.
Soitec qualified its 300mm SOI fab icatio facility i Si gapo e with its fi st custome s fo high-volume Photo ics-SOI ma ufactu i g. This milesto e e ha ces the G oup’s capacity to meet su gi g dema d fo Photo ics-SOI d ive by AI data ce te a chitectu es. Suppo ted by g owi g visibility o dema d, secu ed by custome dow payme ts, Soitec is scali g its i dust ial footp i t th ough a discipli ed, co t olled i vestme t st ategy. The Si gapo e site is ce t al to this effo t; its st ategic locatio a d established 300mm ma ufactu i g capabilities allow Soitec to se ve the Photo ics-SOI ma ket with i c eased agility a d scale. Combi ed with the G oup’s facilities i Be i , this dual-site ma ufactu i g footp i t p ovides obust supply chai esilie ce, fu the solidifyi g Soitec’s positio as a pa t e of choice fo the apidly evolvi g photo ics ecosystem.
O Ju e 29th, 2026, Soitec a d Ze Semi a ou ced a st ategic collabo atio to e able high-volume p oductio of 300mm BCD-o -SOI tech ologies fo ext-ge e atio powe elect o ics. U de the pa t e ship, Soitec will supply Ze Semi with its adva ced 300mm Powe -SOI subst ates to suppo t the developme t a d capacity amp-up of a ew BCD-o -SOI p ocess. By combi i g Soitec’s e gi ee ed subst ate expe tise with Ze Semi’s specialty fou d y capabilities, the collabo atio aims to p ovide fabless compa ies a d i teg ated device ma ufactu e s with a high-pe fo ma ce ma ufactu i g platfo m fo applicatio s i cludi g AI datace te s, elect ic vehicles, huma oid obots a d i dust ial systems. The pa t e ship also suppo ts the b oade t a sitio towa d mo e eliable, powe -de se chip a chitectu es, with BCD-o -SOI e abli g adva ced i teg atio fo high-efficie cy powe dist ibutio , batte y ma ageme t systems a d othe ext-ge e atio applicatio s.
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The live webcast will be available o :https://soitec.e gagest eam.eu o ext.com/2027-fi st-qua te – eve ue
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This docume t is p ovided by Soitec (the “Compa y”) fo i fo matio pu poses o ly.
The Compa y’s busi ess ope atio s a d fi a cial positio a e desc ibed i the Compa y’s U ive sal Regist atio Docume t (which otably i cludes the A ual Fi a cial Repo t). The 2025-2026 U ive sal Regist atio Docume t was filed o Ju e 10th, 2026, with the F e ch stock ma ket autho ity (Auto ité des Ma chés Fi a cie s, o AMF) u de umbe D.26-0417. The F e ch ve sio s of the 2025-2026 U ive sal Regist atio Docume t, togethe with E glish cou tesy t a slatio fo i fo matio pu poses, a e available fo co sultatio si ce Ju e 10th, 2026, o the Compa y’s website (www.soitec.com), i the sectio I vesto s – Regulated i fo matio – Fi a cial Repo ts.
You atte tio is d aw to the isk facto s desc ibed i Chapte 2.1 (Risk facto s a d co t ols mecha ism) of the Compa y’s U ive sal Regist atio Docume t.
This docume t co tai s summa y i fo matio a d should be ead i co ju ctio with the U ive sal Regist atio Docume t.
This docume t co tai s ce tai fo wa d-looki g stateme ts. These fo wa d-looki g stateme ts elate to the Compa y’s futu e p ospects, developme ts a d st ategy a d a e based o a alyses of ea i gs fo ecasts a d estimates of amou ts ot yet dete mi able. By thei atu e, fo wa d-looki g stateme ts a e subject to a va iety of isks a d u ce tai ties as they elate to futu e eve ts a d a e depe de t o ci cumsta ces that may o may ot mate ialize i the futu e. Fo wa d-looki g stateme ts a e ot a gua a tee of the Compa y’s futu e pe fo ma ce. The occu e ce of a y of the isks desc ibed i Chapte 2.1 (Risk facto s a d co t ols mecha ism) of the U ive sal Regist atio Docume t may have a impact o these fo wa d-looki g stateme ts.
The Compa y’s actual fi a cial positio , esults a d cash flows, as well as the t e ds i the secto i which the Compa y ope ates may diffe mate ially f om those co tai ed i this docume t. Fu the mo e, eve if the Compa y’s fi a cial positio , esults, cash-flows a d the developme ts i the secto i which the Compa y ope ates we e to co fo m to the fo wa d-looki g stateme ts co tai ed i this docume t, such eleme ts ca ot be co st ued as a eliable i dicatio of the Compa y’s futu e esults o developme ts.
The Compa y does ot u de take a y obligatio to update o make a y co ectio to a y fo wa d-looki g stateme t i o de to eflect a eve t o ci cumsta ce that may occu afte the date of this docume t.
This docume t does ot co stitute o fo m pa t of a offe o a solicitatio to pu chase, subsc ibe fo , o sell the Compa y’s secu ities i a y cou t y whatsoeve . This docume t, o a y pa t the eof, shall ot fo m the basis of, o be elied upo i co ectio with, a y co t act, commitme t o i vestme t decisio .
Notably, this docume t does ot co stitute a offe o solicitatio to pu chase, subsc ibe fo o to sell secu ities i the U ited States. Secu ities may ot be offe ed o sold i the U ited States abse t egist atio o a exemptio f om the egist atio u de the U.S. Secu ities Act of 1933, as ame ded (the “Secu ities Act”). The Compa y’s sha es have ot bee a d will ot be egiste ed u de the Secu ities Act. Neithe the Compa y o a y othe pe so i te ds to co duct a public offe i g of the Compa y’s secu ities i the U ited States.
Soitec (Eu o ext – Tech Leade s – SBF 120), a wo ld leade i i ovative semico ducto mate ials, has bee developi g cutti g-edge p oducts delive i g both tech ological pe fo ma ce a d e e gy efficie cy fo ove 30 yea s. F om its global headqua te s i F a ce, Soitec is expa di g i te atio ally with its u ique solutio s, a d ge e ated sales of a ou d 600 millio eu os i fiscal yea 2025-2026. Soitec occupies a key positio i the semico ducto value chai , se vi g th ee mai st ategic ma kets: Mobile Commu icatio s, Automotive a d I dust ial, a d Edge a d Cloud AI. The compa y elies o the tale t a d dive sity of ea ly 2,000 employees, ep ese ti g 50 diffe e t atio alities, wo ki g at its sites i Eu ope, the U ited States a d Asia. Nea ly 4,800 pate ts have bee egiste ed by Soitec.
Soitec, Sma tSiC™ a d Sma t Cut™ a e egiste ed t adema ks of Soitec.
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| Qua te ly eve ue(Eu o millio s) | Q1’26 | Q2’26 | Q3’26 | Q4’26 | Mobile Commu icatio s | Edge & Cloud AI | Automotive & I dust ial | Mobile Commu icatio s | -10% | Edge & Cloud AI | -47% | Automotive & I dust ial | -108% |
