3D Semiconductor Packaging
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How Large Will the 3D Semiconductor Packaging Market Size By 2025?
The market for 3D semiconductor packaging has witnessed significant expansion in the past few years. Its size is forecasted to move up from $15.76 billion in 2024 to $18.35 billion in 2025, with a compound annual growth rate (CAGR) of 16.4%. The growth during the past period is credited to factors such as the miniaturization and performance demands, enhancements in semiconductor technology, increased necessity for high-performance computing, the surge in mobile and consumer electronics growth, as well as developments within the IoT and wearable devices domain.
How Big Is the 3D Semiconductor Packaging Market Size Expected to Grow by 2029?
The market size for 3D semiconductor packaging is predicted to observe swift expansion in the coming years. By 2029, projections show it will reach a value of $32.89 billion, with a compound annual growth rate (CAGR) of 15.7%. The predicted growth during this period is due to factors such as the escalating complexity of integrated circuits, sustained need for miniaturization, greater emphasis on thermal management, higher bandwidth requirements, and investments in research and development. Key trends to watch for this period include concentration on research and development, thermal management solutions, deployment of 5G technology, and advances in consumer electronics.
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Which Key Market Drivers Powering 3D Semiconductor Packaging Market Expansion and Growth?
The growth of the 3D semiconductor packaging market is anticipated to be fueled by the expansion of functionality and potential uses of semiconductor or IC packages. Semiconductors are solid materials that exhibit conductivities somewhere between an insulator and a conductor. IC packaging is a widely used technique to enhance integration density and performance within a single package. For example, as stated by the Bureau of Labor Statistics, a US-based government agency, in July 2024, the total trade value of exported semiconductors in 2023 was $65.9 billion, marking a 12.5% downturn from 2022. The top six exporting states contributed 71.0% to the overall trade value. Hence, the 3D semiconductor packaging market is being propelled by the amplified functionality and application range of semiconductor or IC Packages.
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Which Fast-Growing Trends Are Poised to Disrupt the 3D Semiconductor Packaging Market?
A significant trend that is becoming popular in the 3D semiconductor packaging market is the emergence of technological advancements. Top-tier firms are stepping into the semiconductor packaging market and are leveraging innovative technological methods such as 3D stacking techniques. These methods are employed with the agenda of cutting down production costs and personalizing the products to lure in more clients. For instance, in January 2023, Canon, a company based in the US, introduced a semi-conductor lithography i-line stepper system solely for 3D packaging technologies. This system possesses a resolution of 0.8 μm, and is specifically engineered to adapt to the modern day packaging trends. It offers a cost-effective solution for imaging from the start to the end. Canon’s back-end i-line steppe option, the FPA-5520iV HR, holds a resolution of 0.8 μm, designed to meet the changing requirements of the semi-conductor sector. Additionally, Canon’s i-line steppers like FPA-3030i5a and FPA-8000iW, provide cost-effective manufacturing for more compact substrate and advanced panel-level packaging (PLP) applications respectively.
What Are the Emerging Segments in the 3D Semiconductor Packaging Market?
The 3D semiconductor packaging market covered in this report is segmented –
1) By Type: 3D Through Silicon Via, 3D Package On Package, 3D Fan Out Based, 3D Wire Bonded
2) By Material: Organic Substrate, Bonding Wire, Leadframe, Encapsulation, Resins, Ceramic Packages, Die Attach Material, Other Materials
3) By Industry: Electronics, Industrial, Automotive And Transport, Healthcare, IT And Telecommunication Or Aerospace And Defense
Subsegments:
1) By 3D Through Silicon Via (TSV): Wafer-Level Packaging, System-In-Package (SiP), 3D Package On Package (PoP), Memory PoP, Logic PoP
2) By 3D Fan Out Based: Molded Fan-Out (MFO), Wafer Fan-Out (WFO)
3) By 3D Wire Bonded: Standard Wire Bonding, Advanced Wire Bonding Techniques
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Who Are the Global Leaders in the 3D Semiconductor Packaging Market?
Major companies operating in the 3D semiconductor packaging market are Amkor Technology Inc., Advanced Semiconductor Engineering Inc., International Business Machines Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Qualcomm Technologies Inc., Samsung Electronics Corporation Ltd., Siliconware Precision Industries Co. Ltd., STMicroelectronics NV, SÜSS MICROTEC SE, Taiwan Semiconductor Manufacturing Company Limited, 3M Company, Advanced Micro Devices Inc., Walton Advanced Engineering Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Chipmos Technologies Inc., Lingsen Precision Industries Ltd., Micron Technology Inc., Powertech Technology Inc., Tokyo Electron Ltd., Toshiba Corporation, Unisem, United Microelectronics Corporation, United Test and Assembly Center Ltd., ON Semiconductor, Renesas Electronics Corporation, Skyworks Solutions Inc., Analog Devices, Inc., Broadcom Inc., Cypress Semiconductor Corporation, Maxim Integrated, Microchip Technology Inc., Texas Instruments Incorporated
Which are the Top Profitable Regional Markets for the 3D Semiconductor Packaging Industry?
Asia-Pacific was the largest region in the 3D semiconductor packaging market share in 2024. The regions covered in the 3D semiconductor packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.
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