- 6th Ge AMD EPYC SP7 CPU-based platfo ms a e ow shippi g f om leadi g se ve OEMs a d ODMs.
- 6th Ge EPYC CPUs a e expected to powe cloud i sta ces ac oss all majo , global cloud se vice p ovide s, with ece t a ou ceme ts f om Mic osoft Azu e a d OCI showcasi g leade ship age t o chest atio , co cu e t age t sa dboxes, as well as web a d e te p ise applicatio s.
- Powe ed by the ew AMD “Ze 6” a chitectu e, 6th Ge EPYC CPUs delive a b oad po tfolio of wo kload-optimized se ve CPUs spa i g age tic AI, e te p ise, cloud computi g, HPC a d ge e al-pu pose computi g.
SANTA CLARA, Calif., Nov. 10, 2026 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today a ou ced the ge e al availability of the 6th Ge AMD EPYC™ se ve SP7 p ocesso s, based o the ew “Ze 6” a chitectu e, exte di g its histo ical se ve CPU pe fo ma ce leade ship as AI c eates ew dema ds ac oss the data ce te . Systems powe ed by the ew CPUs a e shippi g f om leadi g se ve ve do s, a d cloud i sta ces f om Mic osoft Azu e a d OCI will be ge e ally available soo .
Ac oss five ge e atio s, AMD EPYC p ocesso s have epeatedly aised the sta da d fo se ve CPU pe fo ma ce, e e gy efficie cy a d platfo m choice, culmi ati g i 5th Ge AMD EPYC™ p ocesso s becomi g the fastest- ampi g a d highest-volume EPYC ge e atio i AMD histo y. Now, 6th Ge AMD EPYC se ve CPUs exte d AMD CPU leade ship, u i g AI age ts, accele ated i f ast uctu e a d c itical e te p ise applicatio s, helpi g custome s expa d computi g capacity that u s thei busi esses.
“AI is sig ifica tly expa di g the ole of the CPU ac oss eve y laye of the data ce te ,” said Da McNama a, se io vice p eside t a d ge e al ma age , Compute a d E te p ise AI, AMD. “With 6th Ge AMD EPYC, custome s ca sta da dize o the p ove x86 fou datio while choosi g a wo kload-optimized solutio to u mo e age ts, keep accele ated i f ast uctu e fed, a d powe the busi ess-c itical applicatio s they depe d o .”
6th Ge AMD EPYC is the wo ld’s best se ve CPU po tfolio,i p ovidi g a wo kload-optimized stack that delive s leade ship pe fo ma ce ac oss a dive sity of applicatio s while imp ovi g i f ast uctu e eco omics a d p ese vi g the flexibility of the b oad x86 ecosystem.
Age tic AI adds eve mo e dive sity to a data ce te as a si gle wo kflow ca u age ts, call models, et ieve data, execute code a d i te act with the databases a d applicatio s e te p ises al eady depe d o . The 6th Ge AMD EPYC po tfolio is desig ed fo that eality, matchi g CPU de sity, f eque cy, ba dwidth a d efficie cy to each job while p ese vi g o e commo softwa e, secu ity a d ope atio al fou datio . That wo kload-optimized app oach delive s adva tages ac oss c itical a eas i cludi g age tic AI, e te p ise se vices a d ack-scale solutio s.
Powe Mo e E te p ise a d Cloud Se vices: The 6th Ge AMD EPYC™ 9996 CPU is the wo ld’s best ge e al-pu pose p ocesso , delive i g leade ship pe fo ma ce, pe fo ma ce pe CPU watt, pe fo ma ce pe CPU dolla a d pe fo ma ce pe socket. A AMD EPYC 9996 CPU-based system delive s up to 3.7x mo e pe fo ma ce compa ed with a Nvidia Ve a CPU-based system a d up to 2.2x the pe fo ma ce a d 2.0x the pe fo ma ce pe dolla of a I tel® Xeo ® 6980P system.ii Fo custome s, that ca t a slate i to mo e applicatio s, t a sactio s a d use s suppo ted by each se ve , helpi g c eate capacity fo ew wo kloads withi existi g data ce te powe a d footp i t limitatio s.Lead Ac oss Eve y Tie of Age tic AI: Age tic AI i f ast uctu e spa s th ee disti ct CPU oles – ge e al-pu pose se vices, GPU host odes, a d age t sa dboxes – a d 6th Ge AMD EPYC p ovides a wo kload-optimized p ocesso fo each. High-f eque cy host- ode p ocesso s, with up to 5.3 GHz, ca delive up to 1.8x the LLM output th oughput of p evious ge e atio EPYC p ocesso siii a d high-de sity AMD EPYC p ocesso s ca p ovide up to ~3.3x age ts-pe -CPU-watt adva tage ove Nvidia Ve a a d ~2.5x ove I tel Xeo 6980P fo hosti g age t sa dboxes.iv Additio ally, fo age t sa dboxes, AMD EPYC 9996 CPU-based se ve s ca suppo t a estimated ~1.18x as ma y age ts pe ack withi the same 35 kilowatt powe e velope as systems usi g default powe -ma ageme t setti gs.v
The competitive choice is i c easi gly st aightfo wa d. With 6th Ge AMD EPYC, custome s do ot have to settle fo a o e-size-fits-all CPU i a data ce te that is a ythi g but u ifo m. AMD EPYC delive s the pe fo ma ce, choice a d ecosystem suppo t eeded to move AI f om a swe s to actio a d p epa e fo what comes ext.
6th Ge AMD EPYC exte ds its leade ship f om i dividual se ve s to AMD Helio ™ age tic AI acks, givi g custome s th ee deployme t optio s matched to how a d whe e they ope ate: AMD Helio Liquid, desig ed to sit side-by-side with AMD Helios™ ackscale solutio i la ge-scale age tic AI deployme ts, fo maximum age t de sity; AMD Helio Ai fo expa di g age t capacity withi existi g ai -cooled data ce te s; a d AMD Helio Ai I fe e ce fo combi i g CPU executio a d local GPU i fe e ce i o e ack. AMD has wo ked ac oss the se ve ecosystem to help develop the high-de sity AMD Helio ack with some co figu atio s eachi g up to 73,728 th eads i o e ack, delive i g the most age ts available i a ack. Custome s ca choose the bala ce of CPU a d GPU capacity, cooli g a d co ectivity that fits thei i f ast uctu e as age t dema d g ows.
Systems powe ed by 6th Ge AMD EPYC se ve p ocesso s a e shippi g f om leadi g se ve ve do s:
- Meta is wo ki g with AMD as a lead custome a d has bee validati g 6th Ge AMD EPYC CPU-based platfo ms as the compa ies p epa e fo deployme t at scale.
- Mic osoft Azu e is b i gi g 6th Ge AMD EPYC to custome s ac oss the AI i f ast uctu e stack, with Azu e HDv2 ow i p eview fo AI data p ocessi g, age tic AI a d HPC; Azu e HXv2 fo EDA a d tech ical computi g; a d Azu e ND MI455X v7, based o AMD Helios, fo p oductio -scale AI i fe e ce.
- AMD ece tly sha ed updates to its multige e atio collabo atio with O acle Cloud I f ast uctu e (OCI). OCI Compute E7 cloud compute i sta ces will be powe ed by 6th Ge AMD EPYC se ve p ocesso s, suppo ti g e te p ise applicatio s a d the CPU se vices su ou di g AI models.
With 6th Ge AMD EPYC, AMD is exte di g five ge e atio s of se ve CPU leade ship i to the age tic AI e a; delive i g mo e compute, bette eco omics a d mo e choice f om the se ve to the ack. Ac oss e te p ise, cloud, HPC a d AI i f ast uctu e, EPYC p ovides a b oad po tfolio built fo the wo kloads custome s u today a d what comes ext.
- Lea mo e about 6th Ge AMD EPYC CPUs
- Lea mo e about 6th Ge AMD EPYC Embedded SP7 CPUs
- Lea mo e about AMD Helio Age tic AI Rack
AMD (NASDAQ: AMD) d ives i ovatio i high-pe fo ma ce a d AI computi g to solve the wo ld’s most impo ta t challe ges. Today, AMD tech ology powe s billio s of expe ie ces ac oss cloud a d AI i f ast uctu e, embedded systems, AI PCs a d gami g. With a b oad po tfolio of AI-optimized CPUs, GPUs, etwo ki g a d softwa e, AMD delive s full-stack AI solutio s that p ovide the pe fo ma ce a d scalability eeded fo a ew e a of i tellige t computi g. Lea mo e at www.amd.com.
CAUTIONARY STATEMENT
This p ess elease co tai s fo wa d-looki g stateme ts co ce i g Adva ced Mic o Devices, I c. (AMD) such as the featu es, fu ctio ality, pe fo ma ce, availability, timi g a d expected be efits of AMD p oducts i cludi g the 6th Ge AMD EPYC™ Se ve SP7 p ocesso s, which a e made pu sua t to the Safe Ha bo p ovisio s of the P ivate Secu ities Litigatio Refo m Act of 1995. Fo wa d-looki g stateme ts a e commo ly ide tified by wo ds such as “would,” “may,” “expects,” “believes,” “pla s,” “i te ds,” “p ojects” a d othe te ms with simila mea i g. I vesto s a e cautio ed that the fo wa d-looki g stateme ts i this p ess elease a e based o cu e t beliefs, assumptio s a d expectatio s, speak o ly as of the date of this p ess elease a d i volve isks a d u ce tai ties that could cause actual esults to diffe mate ially f om cu e t expectatio s. Such stateme ts a e subject to ce tai k ow a d u k ow isks a d u ce tai ties, ma y of which a e difficult to p edict a d a e ge e ally beyo d AMD’s co t ol, that could cause actual esults a d othe futu e eve ts to diffe mate ially f om those exp essed i , o implied o p ojected by, the fo wa d-looki g i fo matio a d stateme ts. Mate ial facto s that could cause actual esults to diffe mate ially f om cu e t expectatio s i clude, without limitatio , the followi g: impact of gove me t actio s a d egulatio s such as expo t egulatio s, atio al-secu ity-based egulatio s, impo t ta iffs, t ade p otectio measu es, a d lice si g equi eme ts; competitive ma kets i which AMD’s p oducts a e sold; the cyclical atu e of the semico ducto i dust y; ma ket co ditio s of the i dust ies i which AMD p oducts a e sold; AMD’s ability to i t oduce p oducts o a timely basis with expected featu es a d pe fo ma ce levels; loss of a sig ifica t custome ; eco omic a d ma ket u ce tai ty; qua te ly a d seaso al sales patte s; AMD’s ability to adequately p otect its tech ology o othe i tellectual p ope ty; u favo able cu e cy excha ge ate fluctuatio s; ability of thi d pa ty ma ufactu e s to ma ufactu e AMD’s p oducts o a timely basis i sufficie t qua tities a d usi g competitive tech ologies; availability of esse tial equipme t, mate ials, compo e ts (such as memo y supply), subst ates o ma ufactu i g p ocesses; ability to achieve expected ma ufactu i g yields fo AMD’s p oducts; AMD’s ability to ge e ate eve ue f om its semi-custom SoC p oducts; pote tial secu ity vul e abilities; pote tial secu ity i cide ts i cludi g IT outages, data loss, data b eaches a d cybe attacks; u ce tai ties i volvi g the o de i g a d shipme t of AMD’s p oducts; AMD’s elia ce o thi d-pa ty i tellectual p ope ty to desig a d i t oduce ew p oducts; AMD’s elia ce o thi d-pa ty compa ies fo desig , ma ufactu e a d supply of mothe boa ds, softwa e, memo y a d othe compute platfo m compo e ts; AMD’s elia ce o Mic osoft a d othe softwa e ve do s’ suppo t to desig a d develop softwa e to u o AMD’s p oducts; AMD’s elia ce o thi d-pa ty dist ibuto s a d add-i -boa d pa t e s; impact of modificatio o i te uptio of AMD’s i te al busi ess p ocesses a d i fo matio systems; compatibility of AMD’s p oducts with some o all i dust y-sta da d softwa e a d ha dwa e; costs elated to defective p oducts; failu e to mai tai a efficie t supply chai as custome dema d cha ges; AMD’s ability to ely o thi d pa ty supply-chai logistics fu ctio s; AMD’s ability to effectively co t ol sales of its p oducts o the g ay ma ket; impact of climate cha ge o AMD’s busi ess; AMD’s ability to ealize its defe ed tax assets; pote tial tax liabilities; cu e t a d futu e claims a d litigatio ; impact of e vi o me tal laws, co flict mi e als elated p ovisio s a d othe laws o egulatio s; evolvi g expectatio s f om gove me ts, i vesto s, custome s a d othe stakeholde s ega di g co po ate espo sibility matte s; issues elated to the espo sible use of AI; est ictio s imposed by ag eeme ts gove i g AMD’s otes, the gua a tees of Xili x’s otes a d the evolvi g c edit ag eeme t; AMD’s ability to satisfy fi a cial obligatio s u de gua a tees, leases a d othe comme cial commitme ts; impact of acquisitio s, joi t ve tu es a d/o i vestme ts o AMD’s busi ess a d AMD’s ability to i teg ate acqui ed busi esses; impact of a y impai me t of the combi ed compa y’s assets; political, legal a d eco omic isks a d atu al disaste s; futu e impai me ts of tech ology lice se pu chases; AMD’s ability to att act a d etai key employees; a d AMD’s stock p ice volatility, i cludi g the pote tial impact o the fai value of custome wa a ts a d AMD’s GAAP ea i gs. I vesto s a e u ged to eview i detail the isks a d u ce tai ties i AMD’s Secu ities a d Excha ge Commissio fili gs, i cludi g but ot limited to AMD’s most ece t epo ts o Fo ms 10-K a d 10-Q.
i EPYC-029E: Claim of “best CPU fo cloud, e te p ise, a d AI” is based o AMD’s assessme t of the best ove all combi atio of p ojected pe fo ma ce, th ead de sity, e te p ise wo kload esults, AI be chma k pe fo ma ce, e e gy efficie cy, memo y subsystem capabilities, I/O capabilities, p ocess tech ology, a d built-i secu ity featu es amo g evaluated ge e al-pu pose e te p ise se ve CPUs as of 7/23/2026. “Best” eflects the st o gest ove all combi atio ac oss the evaluated cloud, e te p ise, a d AI c ite ia a d does ot imply leade ship i eve y i dividual wo kload o met ic. P oducts ot available fo compa able testi g o ot positio ed as ge e al-pu pose e te p ise se ve CPUs we e ot i cluded.
ii “9xx6-004C: SPEC ate®2017_i t_base compa iso based o published sco es f om www.spec.o g as of 11/05/2026 a d AMD i te al estimates fo 2P NVIDIA Ve a a d 2P A m AGI as of 10/10/2026. Highest pe fo mi g 2P se ve CPU based o the highest published 2P SPEC ate®2017_i t_base sco e a d the highest published sco e pe CPU (pe socket). Results a d co figu atio s below a e i the fo mat of: [p ocesso ], [co es], [Default CPU Powe o TDP], [1Ku p ice i USD], [sco e], [sco e / CPU W], [sco e / 1Ku p ice i USD], [sco e / co e], [Li k to sco e]2P AMD EPYC 9996, 512C, 600W, $14904 USD, 5470, 9.117, 0.367, 10.68, https://www.spec.o g/cpu2017/ esults/ es2026q4/cpu2017-20261020-52013.html2P AMD EPYC 9965, 384C, 500W, $11988 USD, 3260, 6.520, 0.272, 8.49, https://www.spec.o g/cpu2017/ esults/ es2026q4/cpu2017-20261005-51950.html2P I tel Xeo 6990E+, 576C, 450W, $14995 USD, 3050, 6.778, 0.203, 5.30, https://www.spec.o g/cpu2017/ esults/ es2026q2/cpu2017-20260518-51499.html2P I tel Xeo 6980P, 256C, 500W, $13955 USD, 2510, 5.020, 0.180, 9.80, https://www.spec.o g/cpu2017/ esults/ es2025q4/cpu2017-20251126-50522.html2P NVIDIA Ve a, 176C, 450W, p ici g ot published, AMD estimate 1459, 3.242, /a, 8.292P A m AGI, 272C, 300W, p ici g ot published, AMD estimate 1944, 6.480, /a, 7.15NVIDIA Ve a a d A m AGI sco es a e AMD i te al estimates based o AMD e gi ee i g p ojectio s a d subject to cha ge; NVIDIA Ve a estimate based o published Pho o ix testi g, https://www.pho o ix.com/ eview/ vidia-ve a-be chma ks/. P ici g ot published fo NVIDIA Ve a o A m AGI. I tel CPU W a d p ices at https://a k.i tel.com/ as of 11/05/2026.Sta ti g with the 6th Ge AMD EPYC™ se ve p ocesso family, AMD uses Default CPU Powe to desc ibe p ocesso powe co sumptio , succeedi g AMD’s histo ical TDP efe e ce. Default CPU Powe eflects total powe co sumed ac oss the p ocesso ‘s compute a d I/O dies fo the stated pe fo ma ce ta get. Default CPU Powe a d TDP may both se ve as p ocesso powe efe e ces fo p oduct compa iso , platfo m pla i g, a d pe fo ma ce-pe -watt a alysis.SPEC®, SPEC CPU®, SPEC ate® a d SPECi t® a e egiste ed t adema ks of the Sta da d Pe fo ma ce Evaluatio Co po atio . See www.spec.o g fo mo e i fo matio .AMD CPU p ices as of 11/05/2026.Results may va y due to facto s i cludi g system co figu atio s, softwa e ve sio s a d BIOS setti gs.”
iii 9xx6-022: Model-weight CPU-offload LLM i fe e ce output th oughput compa iso based o AMD i te al testi g measu ed o a PCIe Ge 5 x16 host li k a d estimated p ojected to PCIe Ge 6 x16 by host-to-GPU li k ba dwidth, as of 7/13/2026. Compa iso is a 6th Ge AMD EPYC 96c HF p ocesso host ode (PCIe Ge 6, 5GHz) ve sus a 5th Ge AMD EPYC 9575F (PCIe Ge 5, 5GHz), with a 6th Ge I tel Xeo 6960P host ode as a competitive efe e ce. All measu ed systems we e u 2-socket (full ode) with SMT disabled. Wo kload: Qwe 3-30B-A3B, BF16 weights (app oximately 61 GB eside t), te so -pa allel=1, 1024 i put toke s, 256 output toke s, vLLM CPU-offload, media of =3 ite atio s, measu ed o 1x NVIDIA B200. Measu ed Ge 5 output th oughput fo the 5th Ge AMD EPYC 9575F was 148.4, 114.8, 93.8, a d 61.7 toke s pe seco d at 6, 9, 12, a d 20 GB of offloaded weights, with PCIe eceive ba dwidth pi ed at 89 to 95 pe ce t of the Ge 5 x16 ceili g a d host DRAM ead ba dwidth below 10 pe ce t of its 614 GB/s ceili g, establishi g the PCIe li k ( ot host memo y) as the th oughput limite . Because decode is PCIe-t a sfe -bou d, doubli g host-to-GPU ba dwidth (Ge 5 x16 at 64 GB/s pe di ectio to Ge 6 x16 at 128 GB/s pe di ectio ) p ojects a 1.8x to 1.9x th oughput ceili g fo the 6th Ge AMD EPYC 96c HF p ocesso . Measu ed Ge 5 output th oughput fo the 6th Ge I tel Xeo 6960P was 104.9 a d 82.3 toke s pe seco d at 9 a d 12 GB of offloaded weights (media of =3 ite atio s, same NVIDIA B200 host a d vLLM co figu atio ), ve sus 114.8 a d 93.8 toke s pe seco d fo the 5th Ge AMD EPYC 9575F at the same offload poi ts, so the 5th Ge AMD EPYC 9575F delive s 1.09x a d 1.14x the 6th Ge I tel Xeo 6960P output th oughput (up to 1.1x). Memo y co figu atio was 24x 128 GB DDR5-6400 (AMD) a d 24x 64 GB DDR5-6400 (I tel); host DRAM utilizatio emai ed below 10 pe ce t th oughout, so memo y capacity was ot the th oughput limite . P elimi a y pe fo ma ce estimates based o AMD e gi ee i g p ojectio s o measu eme ts as of 7/13/2026 a d subject to cha ge. PCIe is a egiste ed t adema k of PCI-SIG Co po atio .
iv “9xx6-014B: Compa iso based o published Top-of-stack co e cou ts a d CPU W, Default CPU Powe fo 6th Ge EPYC, a d TDPs fo 5th Ge EPYC, I tel® Xeo ®, a d Nvidia Ve a fo estimated Highest Age ts / CPU W ac oss AMD EPYC™ 256C at 400W, AMD EPYC™ 9965 (500W TDP), Nvidia Ve a (450W TDP), ARM AGI (300W TDP), I tel® Xeo ® 6980P (500W TDP), a d I tel Xeo 6990E+ (450W TDP) powe ed se ve s as of 7/22/2026. 2 th eads pe co e (SMT). 1 th ead pe co e fo ARM AGI.
Age t cou ts a e estimates de ived f om available CPU th ead esou ces used as a p oxy u de a co siste t theo etical wo kload. Actual age t capacity a d th oughput will va y based o wo kload, model, memo y, softwa e, o chest atio , a d system co figu atio .
Sta ti g with the 6th Ge AMD EPYC™ se ve p ocesso family, AMD uses Default CPU Powe to desc ibe p ocesso powe co sumptio , succeedi g AMD’s histo ical TDP efe e ce. Default CPU Powe eflects total powe co sumed ac oss the p ocesso ‘s compute a d I/O dies fo the stated pe fo ma ce ta get. Default CPU Powe a d TDP may both se ve as p ocesso powe efe e ces fo p oduct compa iso , platfo m pla i g, a d pe fo ma ce-pe -watt a alysis. I tel Xeo TDP f om a k.i tel.com. Nvidia Ve a TDP f om https://develope . vidia.com/blog/ vidia-ve a-cpu-sets-a- ew-sta da d-fo -age tic-wo kloads-i -ai-facto ies/. ARM AGI Specificatio s f om https://www.a m.com/p oducts/cloud-datace te /a m-agi-cpu#Specificatio s “
v 9xx6-086A: Age ts pe ack compa iso based o AMD a alysis as of Novembe 2026 of AMD EPYC™ 9996 (256 co es, SMT o , 600W Default CPU Powe ) se ve s with 16 DDR5-8000 RDIMMs pe socket i a 35 kW ack (maximum 20 se ve s pe ack).Default p ovisio i g (830W combi ed SOC a d DIMM powe pe socket): 16 se ve s pe ack, 1.00x age ts pe ack.UPP with a 10% lowe combi ed SOC a d DIMM powe limit (747W pe socket): 17.8 se ve s pe ack, 1.11x age ts pe ack.UPP with a 15% lowe combi ed SOC a d DIMM powe limit (706W pe socket): 18.8 se ve s pe ack, 1.18x age ts pe ack.Age ts pe watt with UPP: AMD EPYC 9996 (256 co es, SMT o , 600W Default CPU Powe ) is estimated to p ovide ~1.9x the age ts pe CPU W of A m AGI (136 co es, 1 th ead pe co e, 300W TDP). With UPP at a 15% lowe combi ed SOC a d DIMM powe limit, the estimated age ts pe ack watt i c ease by 1.18x, fo a estimated ~2.2x age ts pe watt adva tage. A m AGI specificatio s f om https://www.a m.com/p oducts/cloud-datace te /a m-agi-cpu#Specificatio s.Se ve s pe ack a e estimated by scali g the umbe of se ve s that fit i the ack powe e velope i ve sely with the pe -se ve powe limit, without ou di g to whole se ve s.Estimated ave age pe -se ve pe fo ma ce eductio of 0% at the 10% lowe limit a d 1% at the 15% lowe limit, based o AMD i te al testi g of a 5th Ge AMD EPYC™ 128-co e 500W p ocesso u i g SPEC CPU®2017 i tege wo kloads.Age t cou ts a e estimates de ived f om available CPU th ead esou ces used as a p oxy u de a co siste t theo etical wo kload. Actual age t capacity a d th oughput will va y based o wo kload, model, memo y, softwa e, o chest atio , a d system co figu atio .UPP powe savi gs a d pe fo ma ce impact depe d o measu ed DIMM powe a d will va y with wo kload a d ope ati g co ditio s. System ma ufactu e s may va y co figu atio s, yieldi g diffe e t esults.P elimi a y pe fo ma ce estimates based o AMD e gi ee i g p ojectio s o measu eme ts as of Novembe 5, 2026 a d subject to cha ge. SPEC® a d SPEC CPU® a e egiste ed t adema ks of the Sta da d Pe fo ma ce Evaluatio Co po atio . See www.spec.o g fo mo e i fo matio .
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AMD Commu icatio s
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Liz Sti e
AMD I vesto Relatio s
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