ACM Research Enhances Single-Wafer Hot SPM System with Sulfuric Acid Recycle Capability

New capability delive s a 70% sulfu ic acid ecycle ate while mai tai i g st i ge t pa ticle co t ol; System validated ac oss mo e tha 50 p ocess laye s at a fou d y custome

FREMONT, Calif., Oct. 21, 2026 (GLOBE NEWSWIRE) — ACM Resea ch, I c. (“ACM”) (NASDAQ: ACMR), a leadi g supplie of wafe p ocessi g solutio s fo semico ducto a d adva ced packagi g applicatio s, today a ou ced a e ha ced ve sio of its 170°C Si gle-Wafe Hot Sulfu ic Pe oxide Mixtu e (“SPM”) system featu i g a ew sulfu ic acid ecycle capability. The system has bee validated by a fou d y custome ac oss mo e tha 50 p ocess laye s, demo st ati g its ability to suppo t a b oad a ge of clea i g applicatio s.

ACM’s Si gle-Wafe Hot SPM system achieves pa ticle cou ts of 15 o fewe at 15 m a d above, sig ifica tly outpe fo mi g mai st eam ma ket solutio s. U like co ve tio al systems that equi e pe iodic deio ized (“DI”) wate i si g to emove c ystalli e deposits caused by acid mist du i g hot SPM p ocessi g, ACM’s p op ieta y ozzle desig effectively p eve ts such co tami atio , e abli g stable clea i g pe fo ma ce without pe iodic DI wate chambe clea i g. This desig ca help imp ove yields i both logic a d memo y applicatio s while educi g equipme t mai te a ce equi eme ts.

The ew sulfu ic acid ecycle capability achieves a 70% sulfu ic acid ecycle ate while mai tai i g pa ticle co t ol pe fo ma ce as dema ded by custome specificatio s. The i ovatio is expected to save app oximately 400 to s of sulfu ic acid pe tool a ually, thus delive i g sig ifica t e vi o me tal a d cost be efits while meeti g the st i ge t p ocess equi eme ts of semico ducto ma ufactu i g.

“As semico ducto ma ufactu i g becomes mo e complex, custome s eed tech ologies that ca meet i c easi gly dema di g p ocess equi eme ts while imp ovi g ma ufactu i g efficie cy,” said D . David Wa g, P eside t a d Chief Executive Office of ACM. “The co ti ued adva ceme t a d custome validatio of ou Si gle-Wafe Hot SPM platfo m demo st ates ACM’s commitme t to diffe e tiated i ovatio a d ou ability to delive solutio s that add ess the evolvi g eeds of semico ducto ma ufactu e s.”

SPM is widely used i semico ducto ma ufactu i g fo photo esist st ippi g, o ga ic polyme esidue emoval, metallic impu ity a d pa ticle emoval, a d post-CMP clea i g. As semico ducto ma ufactu i g p ocesses become i c easi gly complex, ma ufactu e s must bala ce dema di g clea i g a d pa ticle-co t ol equi eme ts with the eed to ma age chemical co sumptio a d ope ati g efficie cy. ACM’s Si gle-Wafe Hot SPM system is desig ed to add ess these equi eme ts th ough si gle-wafe p ocessi g a d diffe e tiated p ocess a d chambe desig .

The ew sulfu ic acid ecycle capability fu the e ha ces the efficie cy of ACM’s Si gle-Wafe Hot SPM platfo m. By ecove i g a d eusi g a sig ifica t po tio of the sulfu ic acid used du i g p ocessi g while mai tai i g pa ticle co t ol, the system e ables ma ufactu e s to educe chemical co sumptio without comp omisi g p ocess pe fo ma ce. Validatio ac oss mo e tha 50 p ocess laye s at the custome site fu the demo st ates the platfo m’s ability to suppo t a b oad a ge of clea i g applicatio s.

Fo wa d-Looki g Stateme ts

Ce tai stateme ts co tai ed i this p ess elease a e ot histo ical facts a d may be fo wa d-looki g stateme ts withi the mea i g of the P ivate Secu ities Litigatio Refo m Act of 1995. Wo ds such as “pla s,” “expects,” “believes,” “a ticipates,” “desig ed,” a d simila wo ds a e i te ded to ide tify fo wa d-looki g stateme ts. Fo wa d-looki g stateme ts a e based o ACM ma ageme t’s cu e t expectatio s a d beliefs a d i volve a umbe of isks a d u ce tai ties that a e difficult to p edict a d that could cause actual esults to diffe mate ially f om those stated o implied by the fo wa d-looki g stateme ts. A desc iptio of ce tai of these isks, u ce tai ties a d othe matte s ca be fou d i fili gs ACM makes with the U.S. Secu ities a d Excha ge Commissio , all of which a e available at www.sec.gov. Because fo wa d-looki g stateme ts i volve isks a d u ce tai ties, actual esults a d eve ts may diffe mate ially f om esults a d eve ts cu e tly expected by ACM. Reade s a e cautio ed ot to place u due elia ce o these fo wa d-looki g stateme ts, which speak o ly as of the date he eof. ACM u de takes o obligatio to publicly update these fo wa d-looki g stateme ts to eflect eve ts o ci cumsta ces that occu afte the date he eof o to eflect a y cha ge i its expectatio s with ega d to these fo wa d-looki g stateme ts o the occu e ce of u a ticipated eve ts.

About ACM Resea ch, I c.ACM develops, ma ufactu es a d sells semico ducto p ocess equipme t spa i g clea i g, elect oplati g, st ess-f ee polishi g, ve tical fu ace p ocesses, t ack, PECVD, a d wafe – a d pa el-level packagi g tools, e abli g adva ced a d semi-c itical semico ducto device ma ufactu i g. ACM is committed to delive i g customized, high-pe fo ma ce, cost-effective p ocess solutio s that semico ducto ma ufactu e s ca use i ume ous ma ufactu i g steps to imp ove p oductivity a d p oduct yield. Fo mo e i fo matio , visit www.acm .com.

© ACM Resea ch, I c. The ACM Resea ch logo is a t adema k of ACM Resea ch, I c. Fo co ve ie ce, the t adema k appea s i this p ess elease without the ™ symbol, but that p actice does ot mea ACM will ot asse t, to the fullest exte t u de applicable law, its ights to such t adema ks. All othe t adema ks a e the p ope ty of thei espective ow e s.