- Compa y expects st o g multi-yea g owth as global AI i f ast uctu e buildout fuels dema d fo leadi g-edge fou d y-logic, DRAM a d adva ced packagi g – a eas whe e Applied has built ma ket leade ship
- Expects wafe fab equipme t (WFE) spe di g to g ow faste th ough 2030 tha ove the past decade; ta gets mo e tha 2 pe ce tage poi ts of WFE sha e gai f om cale da 2025 to 2030
- Ta gets highe p ofitability th ough 2030 with o -GAAP g oss ma gi ta get of app oximately 54 pe ce t a d o -GAAP ope ati g ma gi ta get of app oximately 40 pe ce t
- Committed to dist ibute 80 to 100 pe ce t of f ee cash flow to sha eholde s ove time
SAN FRANCISCO, Oct. 13, 2026 (GLOBE NEWSWIRE) — At its 2026 SEMICON West I vesto B eakfast P ese tatio held today, Applied Mate ials, I c. p ese ted its lo ge -te m g owth expectatio s a d outli ed how its leade ship i mate ials e gi ee i g positio s the compa y to outpe fo m the wafe fab equipme t (WFE) ma ket ove the comi g yea s.
“The global buildout of AI i f ast uctu e is d ivi g a ew e a of g owth fo wafe fab equipme t,” said Ga y Dicke so , P eside t a d CEO of Applied Mate ials. “Applied Mate ials has built leade ship i the fastest g owi g a eas of the ma ket that have the g eatest impact o AI computi g pe fo ma ce, powe efficie cy a d cost, a d ou adva ced se vices offe i gs e able chipmake s to i c ease yield a d fab output. Ou i dust y-leadi g capabilities positio Applied fo co ti ued g owth a d outpe fo ma ce i the yea s ahead.”
The ace fo AI computi g leade ship equi es t eme dous tech ology i ovatio a d capacity expa sio to suppo t i f ast uctu e scali g, which is fueli g sustai ed WFE i vestme ts – bigge tha a y of the i dust y’s past g owth d ive s. The g owth a d dive sity of AI applicatio s f om ge e ative to age tic a d physical AI equi e i c easi g amou ts of silico . Applied expects leadi g-edge fou d y-logic, DRAM a d adva ced packagi g to d ive a ou d 75 pe ce t of WFE g owth f om 2025-2030. Applied has st o g umbe -o e p ocess equipme t positio s i all th ee a eas a d is ta geti g to gai mo e tha 2 pe ce tage poi ts of WFE ma ket sha e f om cale da 2025 to 2030.
To suppo t the i dust y’s capacity expa sio , Applied is utilizi g its u ique eBeam tech ology a d adva ced se vice solutio s to help chipmake s accele ate the amp of ew p ocess odes a d optimize yield, output a d cost i high-volume ma ufactu i g. With the i dust y’s highest esolutio a d fastest imagi g capabilities, Applied’s eBeam equipme t po tfolio is expected to ge e ate $2 billio i eve ue i cale da yea 2026. The compa y is expecti g se vice eve ue to g ow mo e tha 20 pe ce t this cale da yea a d to exceed $12 billio i eve ue by cale da yea 2030, ep ese ti g a mid-tee s compou d a ual g owth ate.
“Fo the past 10 yea s, Applied Mate ials has bee maki g st ategic i vestme ts to build the i dust y’s most e abli g po tfolio fo AI computi g,” said B ice Hill, Se io Vice P eside t a d CFO. “As AI d ives wafe fab equipme t g owth, we a e focused o fu the i c easi g p ofitability a d ope ati g leve age while i vesti g i R&D p og ams that will fuel ou outpe fo ma ce i to the futu e.”
Based o the compa y’s expectatio s fo semico ducto i dust y g owth, Applied is i vesti g to mo e tha double its R&D lab a d ma ufactu i g capacity f om cu e t levels by 2030. The compa y yeste day u veiled its ew Equipme t a d P ocess I ovatio a d Comme cializatio (EPIC) Ce te i Silico Valley, the wo ld’s la gest facility dedicated to collabo ative semico ducto p ocess tech ology a d ma ufactu i g equipme t R&D. To date, Applied has a ou ced 15 EPIC Ce te pa t e ships with leadi g chipmake s, systems compa ies, equipme t pa t e s a d u ive sities. Applied has also ece tly expa ded its ma ufactu i g i f ast uctu e i Austi , Texas, Si gapo e a d T eviso, Italy.
No -GAAP Fi a cial Measu esFo wa d-looki g o -GAAP g oss ma gi a d o -GAAP ope ati g ma gi ta gets fo 2030 assume o -GAAP adjustme ts as applicable fo futu e pe iods, which we a e u able to p edict without u easo able effo ts due to thei i he e t u ce tai ty. F ee cash flow is a o -GAAP measu e a d is defi ed as et cash p ovided by ope ati g activities less capital expe ditu es. Ma ageme t uses o -GAAP fi a cial measu es to evaluate the compa y’s ope ati g a d fi a cial pe fo ma ce a d fo pla i g pu poses, a d as pe fo ma ce measu es i its executive compe satio p og am. Applied believes these measu es e ha ce a ove all u de sta di g of its pe fo ma ce a d i vesto s’ ability to eview the compa y’s busi ess f om the same pe spective as the compa y’s ma ageme t, a d facilitate compa iso s of esults with p io pe iods o a co siste t basis by excludi g items that ma ageme t does ot believe a e i dicative of Applied’s o goi g ope ati g pe fo ma ce. The e a e limitatio s i usi g o -GAAP fi a cial measu es because the o -GAAP fi a cial measu es a e ot p epa ed i acco da ce with ge e ally accepted accou ti g p i ciples, may be diffe e t f om o -GAAP fi a cial measu es used by othe compa ies, a d may exclude ce tai items that may have a mate ial impact upo ou epo ted fi a cial esults.
Fo wa d-Looki g Stateme tsThis p ess elease co tai s fo wa d-looki g stateme ts, i cludi g those ega di g a ticipated g owth a d t e ds i ou busi esses a d ma kets, i dust y outlooks a d dema d d ive s, tech ology t a sitio s, ou busi ess a d fi a cial pe fo ma ce a d ma ket sha e positio s, ou capital allocatio a d cash deployme t st ategies, ou i vestme t a d g owth st ategies, ou developme t of ew p oducts a d tech ologies, the pla s a d expectatio s fo the EPIC Ce te , ou busi ess outlook, expectatio s fo ou fi a cial pe fo ma ce fo cale da yea 2026, ou busi ess a d fi a cial ta gets fo 2030, a d othe stateme ts that a e ot histo ical facts. These stateme ts a d thei u de lyi g assumptio s a e subject to isks a d u ce tai ties a d a e ot gua a tees of futu e pe fo ma ce. Facto s that could cause actual esults to diffe mate ially f om those exp essed o implied by such stateme ts i clude, without limitatio : the level of dema d fo ou p oducts; global eco omic, political a d i dust y co ditio s, i cludi g cha ges i i te est ates a d p ices fo goods a d se vices; global t ade issues, cha ges i t ade a d expo t egulatio s, lice se equi eme ts, a d thei i te p etatio , a d ou ability to obtai lice ses o autho izatio s o a timely basis, if at all; cha ges i ta iffs, a y etaliato y measu es, a d ou ability to mitigate the impact of ta iffs; the effects of geopolitical tu moil o co flicts; dema d fo semico ducto chips a d elect o ic devices; custome s’ tech ology a d capacity equi eme ts; the i t oductio of ew a d i ovative tech ologies, a d the timi g of tech ology t a sitio s; ou ability to develop, delive a d suppo t ew p oducts a d tech ologies; ou ability to meet custome dema d, a d ou supplie s’ ability to meet ou dema d equi eme ts; the co ce t ated atu e of ou custome base; ou ability to expa d ou cu e t ma kets, i c ease ma ket sha e a d develop ew ma kets; ma ket accepta ce of existi g a d ewly developed p oducts; ou ability to obtai a d p otect i tellectual p ope ty ights i key tech ologies; cybe secu ity i cide ts affecti g us o ou supplie s, custome s o ve do s; ou ability to achieve the objectives of ope atio al a d st ategic i itiatives, alig ou esou ces a d cost st uctu e with busi ess co ditio s, a d att act, motivate a d etai key employees; acquisitio s, i vestme ts a d divestitu es; cha ges i i come tax laws; the va iability of ope ati g expe ses a d esults amo g p oducts a d segme ts, a d ou ability to accu ately fo ecast futu e esults, ma ket co ditio s, custome equi eme ts a d busi ess eeds; ou ability to e su e complia ce with applicable law, ules a d egulatio s; a d othe isks a d u ce tai ties desc ibed i ou fili gs with the Secu ities a d Excha ge Commissio , i cludi g ou most ece t Fo ms 10-K, 10-Q a d 8-K. All fo wa d-looki g stateme ts a e based o ma ageme t’s cu e t estimates, p ojectio s a d assumptio s, a d we assume o obligatio to update them.
About Applied Mate ialsApplied Mate ials, I c. (Nasdaq: AMAT) is the leade i mate ials e gi ee i g solutio s that a e at the fou datio of vi tually eve y ew semico ducto a d adva ced display i the wo ld. The tech ology we c eate is esse tial to adva ci g AI a d accele ati g the comme cializatio of ext-ge e atio chips. At Applied, we push the bou da ies of scie ce a d e gi ee i g to delive mate ial i ovatio that cha ges the wo ld. Lea mo e at www.appliedmate ials.com.
Co tact:Ricky G adwohl (edito ial/media) 408.235.4676Mike Sulliva (fi a cial commu ity) 408.986.7977
![]()
