BE Semiconductor Industries N.V. Announces Q2-26 and H1-26 Results

Q2-26 Reve ue a d Net I come of € 249.9 Millio a d € 89.0 Millio , Respectively, Up 68.7% a d 177.3%, Respectively, vs. Q2-25. O de s of € 292.9 millio Up 128.8% vs. Q2-25

H1-26 Reve ue a d Net I come of € 434.7 Millio a d € 140.6 Millio , Respectively, Up 48.8% a d 121.1%, Respectively, vs. H1-25. O de s of € 562.6 millio Up 116.5% vs. H1-25

DUIVEN, The Nethe la ds, July 23, 2026 (GLOBE NEWSWIRE) — BE Semico ducto I dust ies N.V. (the “Compa y” o “Besi”) (Eu o ext Amste dam: BESI; OTC ma kets: BESIY), a leadi g ma ufactu e of assembly equipme t fo the semico ducto i dust y, today a ou ced its esults fo the seco d qua te a d fi st half yea e ded Ju e 30, 2026.

Key Highlights Q2-26

• Reve ue of € 249.9 millio g ew € 65.0 millio , o 35.2%, vs. Q1-26 a d € 101.8 millio , o 68.7%, vs. Q2-25 due p ima ily to b oad based g owth, pa ticula ly fo hyb id bo di g, photo ics a d datace te applicatio s a d, to a lesse exte t, i c eased dema d fo mobile applicatio s
• O de s of € 292.9 millio ose 8.6% vs. Q1-26 due p ima ily to i c eased dema d fo datace te , photo ics a d AI powe ma ageme t applicatio s. Vs. Q2-25, up 128.8% due to b oad based g owth, pa ticula ly fo AI computi g applicatio s
• G oss ma gi of 65.7% ose 2.2 poi ts vs. Q1-26 a d 2.4 poi ts vs. Q2-25 due p ima ily to a mo e favo able p oduct mix
• Net i come of € 89.0 millio ose 72.5% vs. Q1-26 a d 177.3% vs. Q2-25 due to highe eve ue, g oss ma gi s a d cost co t ol effo ts. Q2-26 et ma gi ose to 35.6% vs. 27.9% i Q1-26 a d 21.6% i Q2-25
• Net cash a d deposits g ew by 58.8% vs. Ma ch 31, 2026 to each € 164.0 millio

Key Highlights H1-26

• Reve ue of € 434.7 millio i c eased 48.8% vs. H1-25 due to highe dema d fo AI computi g applicatio s a d, to a lesse exte t, i c eased dema d fo mobile applicatio s
• O de s of € 562.6 millio ose 116.5% vs. H1-25 due to b oad based g owth ac oss e d-use ma kets with st e gth i photo ics, hyb id bo di g a d datace te computi g applicatio s
• G oss ma gi of 64.7% i c eased 1.3 poi ts vs. H1-25 p ima ily due to a mo e favo able p oduct mix
• Net i come of € 140.6 millio g ew 121.1% vs. H1-25 due to highe eve ue, g oss ma gi s a d cost co t ol effo ts which limited ove head g owth. Besi’s et ma gi g ew to 32.3% vs. 21.7% i H1-25

Q3-26 Outlook   

• Reve ue expected to i c ease 10-15% vs. the € 249.9 millio epo ted i Q2-26
• G oss ma gi expected to a ge betwee 63-65% vs. the 65.7% ealized i Q2-26 due to a less favo able p oduct mix
• Ope ati g expe ses expected to be flat to up 5% vs. the € 55.3 millio epo ted i Q2-26

* Reflects cash divide d payme ts of € 125.4 millio a d € 172.8 millio i Q2-26 a d Q2-25, espectively, a d the edemptio of Besi’s 2029 Co ve tible Notes i Q2-26.

Richa d W. Blickma , P eside t a d Chief Executive Office of Besi, comme ted:“Besi epo ted st o g seco d qua te a d fi st half 2026 esults as favo able o de mome tum co ti ued fo both ou t aditio al a d wafe level assembly systems. Fo the fi st half yea , Besi’s eve ue of € 434.7 millio a d et i come of € 140.6 millio i c eased by 48.8% a d 121.1%, espectively, ve sus H1-25 p ima ily due to sig ifica tly expa ded AI i f ast uctu e spe di g, a modest ecove y i t aditio al mobile a d auto/i dust ial ma kets a d discipli ed ove head ma ageme t. Simila ly, et ma gi s i c eased f om 21.7% i H1-25 to 32.3% i H1-26 aided by imp oved g oss ma gi s a d sig ifica t ope ati g leve age i ou busi ess model as baseli e ope ati g expe ses educed f om 30.0% of eve ue i Q2-25 to 18.9% i Q2-26. Ou et cash positio at the e d of Q2-26 i c eased by 58.8% ve sus Ma ch 31, 2026 to each € 164.0 millio . G owth was p ima ily due to the co ve sio i to equity of Besi’s € 175 millio of Co ve tible Se io Notes due 2029 a d st o g cash flow ge e ated f om ope atio s which offset the payme t of € 125.4 millio fo the a ual divide d i Q2-26.

“H1-26 o de s ose to € 562.6 millio , a i c ease of € 302.7 millio , o 116.5%, ve sus H1-25 due to b oad based g owth ac oss all Besi e d-use ma kets a d p oducts. O de g owth was st o g fo photo ics a d datace te applicatio s a d hyb id bo di g capacity expa sio fo both cu e t a d ext ge e atio AI devices. We also eceived ew o de s fo AI powe ma ageme t applicatio s i Q2-26 f om multiple custome s. Ove all, we estimate that system o de s fo AI applicatio s ose to app oximately 60% i H1-26 ve sus app oximately 50% i H1-25. I additio , we saw e ewed g owth fo high e d sma tpho e applicatio s i H1-26 ve sus cyclical lows eached i 2025 due p ima ily to i c eme tal capacity pu chases a d ew p oduct i t oductio s pla ed fo 2026.

“P og ess co ti ued o ou wafe level assembly age da this yea . Hyb id bo di g custome adoptio i c eased f om 15 at yea e d 2025 to 21 at the e d of Q2-26, use cases i c eased fo logic, memo y, co-packaged optics a d co sume applicatio s a d o de s i c eased mate ially ve sus H1-25 as sig ifica t ew capacity was added. I additio , the e we e multiple ew p oduct a ou ceme ts made this yea elated to datace te a d co sume CPU applicatio s utilizi g hyb id bo di g. P og ess also was made o ou TC Next age da with i c eased eve ue a d custome adoptio ve sus H1-25.

“Fo the qua te , eve ue of € 249.9 millio i c eased by 68.7% a d 35.2% ve sus Q2-25 a d Q1-26, espectively. G owth ve sus Q2-25 was p ima ily due to i c eased AI spe di g fo photo ics, datace te a d hyb id bo di g applicatio s as well as i c eased dema d fo mobile applicatio s. Additio al hyb id bo di g o de s we e eceived i Q2-26 f om two epeat custome s a d o e ew hype scale custome . Simila ly, o de s of € 292.9 millio ose by 128.8% ve sus Q2-25 a d 8.6% ve sus Q1-26. Of ote, Besi’s o de s fo the last twelve mo ths i c eased to a eco d € 987.6 millio . Q2-26 et i come of € 89.0 millio i c eased by 177.3% ve sus Q2-25 a d 72.5% ve sus Q1-26 as g oss ma gi s imp oved a d ope ati g expe se g owth was limited despite i c eased spe di g fo developme t a d custome suppo t activities. Simila ly, et ma gi s i c eased to 35.6% ve sus 21.6% i Q2-25.

“We see o de mome tum co ti ui g i Q3-26 due to o goi g dema d st e gth fo cu e t a d futu e AI applicatio s as well as imp oveme t i Besi’s t aditio al mai st eam e d-use ma kets. Custome s i dicate that we a e i a multi-yea AI capex cycle fu the suppo ted by i c eased dema d fo age tic AI applicatio s, which a e d ivi g i c eased dema d fo datace te CPUs a d ma y of ou adva ced packagi g systems. Besi’s st ategy is cu e tly focused o expa di g ou oppo tu ities i wafe level assembly, i c easi g ou pe et atio of CoWoS, CoPoS a d photo ics ma kets a d ampi g ou supply chai a d se vice/suppo t capabilities i alig me t with ma ket co ditio s.

“Based o ou backlog a d feedback f om custome s, we a ticipate that Besi’s Q3-26 eve ue will i c ease by 10-15% ve sus Q2-26. I additio , g oss ma gi s a e a ticipated to dec ease to a a ge of 63-65% due to a less favo able p oduct mix tha Q2-26. Ope ati g expe ses a e a ticipated to be flat to up 5% due p ima ily to i c eased developme t spe di g.”

Sha e Repu chase ActivityDu i g the qua te , Besi epu chased app oximately 57,000 of its o di a y sha es at a ave age p ice of € 257.58 pe sha e fo a total of € 14.7 millio . Cumulatively, as of Ju e 30, 2026, a total of € 40.1 millio was pu chased u de the cu e t € 60 millio sha e epu chase pla at a ave age p ice of € 180.83 pe sha e.

O May 5, 2026, Besi exe cised its ea ly edemptio optio with espect to its € 175 millio 1.875% Se io U secu ed Co ve tible bo ds due 2029 (the “2029 Notes”) which esulted i the co ve sio i to equity du i g Q2-26 of all of the 2029 Notes outsta di g a d the issua ce of 1.5 millio sha es held i t easu y elated the eto. As a esult, Besi held app oximately 0.3 millio sha es i t easu y at Ju e 30, 2026, equal to 0.4% of its sha es outsta di g.

Impo ta t Dates

Basis of P ese tatio The accompa yi g Co solidated Fi a cial Stateme ts have bee p epa ed i acco da ce with I te atio al Fi a cial Repo ti g Sta da ds (“IFRS”) as adopted by the Eu opea U io . Refe e ce is made to the Summa y of Sig ifica t Accou ti g Policies to the Notes to the Co solidated Fi a cial Stateme ts as i cluded i ou 2025 A ual Repo t, which is available o www.besi.com.

Co tacts:Richa d W. Blickma , P eside t & CEOA d ea Kopp-Battaglia, Se io Vice P eside t Fi a ce        Claudia Visse s, Executive Sec eta y/IR coo di ato Edmo d F a co, VP Co po ate Developme t/US IR coo di ato Tel. (31) 26 319 4500                        i vesto . elatio s@besi.com   

About Besi Besi is a leadi g ma ufactu e of assembly equipme t supplyi g a b oad po tfolio of adva ced packagi g solutio s to the semico ducto a d elect o ics i dust ies. We offe custome s high levels of accu acy, eliability a d th oughput at a lowe cost of ow e ship with a p i cipal focus o wafe level a d subst ate assembly solutio s. Custome s a e p ima ily leadi g semico ducto ma ufactu e s, fou d ies, assembly subco t acto s a d elect o ics a d i dust ial compa ies. Besi’s o di a y sha es a e listed o Eu o ext Amste dam (symbol: BESI). Its Level 1 ADRs a e listed o the OTC ma kets (symbol: BESIY) a d its headqua te s a e located i Duive , the Nethe la ds. Fo mo e i fo matio , please visit ou website at www.besi.com.

Cautio Co ce i g Fo wa d-Looki g Stateme ts This p ess elease co tai s stateme ts about ma ageme t’s futu e expectatio s, pla s a d p ospects of ou busi ess that co stitute fo wa d-looki g stateme ts, which a e fou d i va ious places th oughout the p ess elease, i cludi g, but ot limited to, stateme ts elati g to expectatio s of o de s, et sales, p oduct shipme ts, expe ses, timi g of pu chases of assembly equipme t by custome s, g oss ma gi s, ope ati g esults a d capital expe ditu es. The use of wo ds such as “a ticipate”, “estimate”, “expect”, “ca ”, “i te d”, “believes”, “may”, “pla ”, “p edict”, “p oject”, “fo ecast”, “will”, “would”, a d simila exp essio s a e i te ded to ide tify fo wa d-looki g stateme ts, although ot all fo wa d-looki g stateme ts co tai these ide tifyi g wo ds. The fi a cial guida ce set fo th u de the headi g “Outlook” co tai s such fo wa d-looki g stateme ts. While these fo wa d-looki g stateme ts ep ese t ou judgme ts a d expectatio s co ce i g the developme t of ou busi ess, a umbe of isks, u ce tai ties a d othe impo ta t facto s could cause actual developme ts a d esults to diffe mate ially f om those co tai ed i fo wa d-looki g stateme ts, i cludi g a y i ability to mai tai co ti ued dema d fo ou p oducts; failu e of a ticipated o de s to mate ialize o postpo eme t o ca cellatio of o de s, ge e ally without cha ges; the volatility i the dema d fo semico ducto s a d ou p oducts a d se vices; failu e to develop ew a d e ha ced p oducts a d i t oduce them at competitive p ice levels; failu e to adequately ma age costs a d expe ses i li e with eve ue; loss of sig ifica t custome s, i cludi g th ough i dust y co solidatio o the eme ge ce of i dust y allia ces; le gthe i g of the sales cycle; acts of te o ism a d viole ce; dis uptio o failu e of ou i fo matio tech ology systems; co solidatio activity a d i dust y allia ces i the semico ducto i dust y that may esult i fu the i c eased custome co ce t atio , i ability to fo ecast dema d a d i ve to y levels fo ou p oducts; the i teg ity of p oduct p ici g a d p otectio of ou i tellectual p ope ty i fo eig ju isdictio s; isks, such as cha ges i t ade egulatio s, co flict mi e als egulatio s, cu e cy fluctuatio s, political i stability a d wa , associated with substa tial fo eig custome s, supplie s a d fo eig ma ufactu i g ope atio s, pa ticula ly to the exte t occu i g i the Asia Pacific egio whe e we have a substa tial po tio of ou p oductio facilities; pote tial i stability i fo eig capital ma kets; the isk of failu e to successfully ma age ou dive se ope atio s; a y i ability to att act a d etai skilled pe so el, i cludi g as a esult of est ictio s o immig atio , t avel o the availability of visas fo skilled tech ology wo ke s; a d the othe isks detailed i the Risk Ma ageme t sectio of ou A ual Repo t. We exp essly disclaim a y obligatio to update o alte these fo wa d-looki g stateme ts fo evisio s o cha ges whethe as a esult of ew i fo matio , futu e eve ts o othe wise afte the date of this elease.

I additio , the U ited States a d othe cou t ies have ece tly levied ta iffs a d taxes o ce tai goods a d could sig ifica tly i c ease o impose ew ta iffs o a b oad a ay of goods. They have imposed, a d may co ti ue to impose, ew t ade est ictio s a d expo t egulatio s. I c eased o ew ta iffs a d additio al taxes, i cludi g a y etaliato y measu es, t ade est ictio s a d expo t egulatio s, could egatively impact e d-use dema d a d custome i vestme t i semico ducto assembly equipme t, i c ease Besi’s supply chai complexity a d ma ufactu i g costs, dec ease ma gi s, educe the competitive ess of ou p oducts o est ict ou ability to sell p oducts, p ovide se vices o pu chase ecessa y equipme t a d supplies. A y o all of the fo egoi g facto s could have a mate ial a d adve se effect o ou busi ess, esults of ope atio s o fi a cial co ditio . I additio , i vesto s should co side those additio al isk facto s set fo th i Besi’s a ual epo t fo the yea e ded Decembe 31, 2025 a d othe key facto s that could adve sely affect ou busi esses a d fi a cial pe fo ma ce co tai ed i ou fili gs a d epo ts, i cludi g ou statuto y co solidated stateme ts. We exp essly disclaim a y obligatio to update o alte ou fo wa d-looki g stateme ts whethe as a esult of ew i fo matio , futu e eve ts o othe wise.